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公开(公告)号：US4582576A
公开(公告)日：1986-04-15
申请号：US716260
申请日：1985-03-26
CPC分类号： C25D3/60 , C25D3/32 , C25D3/36 , H05K3/3473
摘要： An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoborate and comprise (a) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (b) at least one alkane sulfonic acid or alkanolsulfonic acid, (c) at least one nonionic, cationic or amphoteric surfactant, (d) an effective amount of at least one primary brightening agent selected from the group consisting of aromatic aldehydes, acetophenones, and carbonyl compounds having the general formulaAr--C(H).dbd.C(H)--C(O)--CH.sub.3 (III)wherein Ar is a phenyl, naphthyl, pyridyl, thiophenyl or furyl group, and (e) an effective amount of a secondary brightening agent selected from the group consisting of lower aliphatic aldehydes and substituted olefins of the formula ##STR1## wherein R.sub.1 is a carboxy, carboxamide, alkali metal carboxylate, ammonium carboxylate, amine carboxylate or allyl carboxylate, and R.sub.2, R.sub.3 an R.sub.4 are each independently hydrogen or lower alkyl groups. Methods for the electrodeposition of tin, lead, or tin-lead alloys from such baths also are described.
摘要翻译： 描述了用于在基底上电沉积锡，铅或锡铅合金的酸性电镀液。 电镀浴不含氟硼酸盐，并且包含（a）至少一种选自亚锡盐，铅盐或亚锡和铅盐的混合物的浴溶性金属盐，（b）至少一种烷烃 磺酸或链烷醇磺酸，（c）至少一种非离子，阳离子或两性表面活性剂，（d）有效量的至少一种选自芳族醛，苯乙酮和具有通式 Ar-C（H）= C（H）-C（O）-CH 3（III）其中Ar是苯基，萘基，吡啶基，噻吩基或呋喃基，和（e）有效量的二次增白剂， 由式（IV）的低级脂族醛和取代烯烃组成的组，其中R 1是羧基，羧酰胺，碱金属羧酸盐，羧酸铵，羧酸胺或羧酸烯丙基酯，R 2，R 3和R 4各自独立地是氢 或低级烷基。 还描述了用于从这种浴中电沉积锡，铅或锡铅合金的方法。
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