Plating bath and method for electroplating tin and/or lead
    1.
    发明授权
    Plating bath and method for electroplating tin and/or lead 失效
    电镀锡和/或铅的电镀浴和方法

    公开(公告)号:US4582576A

    公开(公告)日:1986-04-15

    申请号:US716260

    申请日:1985-03-26

    摘要: An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoborate and comprise (a) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (b) at least one alkane sulfonic acid or alkanolsulfonic acid, (c) at least one nonionic, cationic or amphoteric surfactant, (d) an effective amount of at least one primary brightening agent selected from the group consisting of aromatic aldehydes, acetophenones, and carbonyl compounds having the general formulaAr--C(H).dbd.C(H)--C(O)--CH.sub.3 (III)wherein Ar is a phenyl, naphthyl, pyridyl, thiophenyl or furyl group, and (e) an effective amount of a secondary brightening agent selected from the group consisting of lower aliphatic aldehydes and substituted olefins of the formula ##STR1## wherein R.sub.1 is a carboxy, carboxamide, alkali metal carboxylate, ammonium carboxylate, amine carboxylate or allyl carboxylate, and R.sub.2, R.sub.3 an R.sub.4 are each independently hydrogen or lower alkyl groups. Methods for the electrodeposition of tin, lead, or tin-lead alloys from such baths also are described.

    摘要翻译: 描述了用于在基底上电沉积锡,铅或锡铅合金的酸性电镀液。 电镀浴不含氟硼酸盐,并且包含(a)至少一种选自亚锡盐,铅盐或亚锡和铅盐的混合物的浴溶性金属盐,(b)至少一种烷烃 磺酸或链烷醇磺酸,(c)至少一种非离子,阳离子或两性表面活性剂,(d)有效量的至少一种选自芳族醛,苯乙酮和具有通式 Ar-C(H)= C(H)-C(O)-CH 3(III)其中Ar是苯基,萘基,吡啶基,噻吩基或呋喃基,和(e)有效量的二次增白剂, 由式(IV)的低级脂族醛和取代烯烃组成的组,其中R 1是羧基,羧酰胺,碱金属羧酸盐,羧酸铵,羧酸胺或羧酸烯丙基酯,R 2,R 3和R 4各自独立地是氢 或低级烷基。 还描述了用于从这种浴中电沉积锡,铅或锡铅合金的方法。

    Electroplating zinc, ammonia-free acid zinc plating bath therefor and
additive composition therefor
    2.
    发明授权
    Electroplating zinc, ammonia-free acid zinc plating bath therefor and additive composition therefor 失效
    电镀锌,无氨酸锌电镀浴及其添加剂组成

    公开(公告)号:US4075066A

    公开(公告)日:1978-02-21

    申请号:US762883

    申请日:1977-01-27

    IPC分类号: C25D3/22

    CPC分类号: C25D3/22

    摘要: The present invention provides an ammonia-free acid zinc plating bath for electrodepositing bright zinc on a substrate in which the zinc deposit produced thereby is ductile and presents a glossy to bright coating on the substrate over a wide cathodic current density range. The ammonia-free acid zinc plating baths of the invention comprise zinc ions, chloride ions, at least one polyoxyalkylated naphthol, at least one aromatic carboxylic acid or bath-soluble salt thereof, and at least one anionic aromatic sulfonic acid or bath-soluble salt thereof. In addition to the above components, the ammonia-free acid zinc plating baths of the invention may contain at least one nonionic polyoxyethylene compound and at least one aromatic aldehyde, ketone, or mixtures thereof. The ammonia-free acid zinc plating baths of the invention are free from significant amounts of complexing agents that would impede the removal of zinc ions from the baths prior to disposal.

    摘要翻译: 本发明提供了一种用于在其上由此生产的锌沉积物延展性并且在宽的阴极电流密度范围上在基板上呈现光泽的光泽涂层的基板上电沉积亮锌的无氨酸锌电镀浴。 本发明的无氨酸锌电镀液包含锌离子,氯离子,至少一种聚氧化烷基化萘酚,至少一种芳族羧酸或其可溶于浴的盐,以及至少一种阴离子芳香族磺酸或浴溶性盐 其中。 除了上述成分之外,本发明的无氨酸锌电镀液可以含有至少一种非离子聚氧乙烯化合物和至少一种芳族醛,酮或其混合物。 本发明的无氨酸锌电镀浴没有大量的络合剂,其将在处置之前阻止从浴中除去锌离子。