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公开(公告)号:US09678137B2
公开(公告)日:2017-06-13
申请号:US14190850
申请日:2014-02-26
IPC分类号: G01R31/04
CPC分类号: G01R31/048
摘要: Methods and systems for monitoring contact joint integrity in an information handling system may include precisely monitoring a change in resistance of a resistive element associated with a contact joint. The change in resistance of the resistive element may be indicative of the integrity of the contact joint. The resistance may be measured using a modulated current source and by demodulating a voltage signal resulting from the modulated current flowing across the resistive element.
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公开(公告)号:US20150241504A1
公开(公告)日:2015-08-27
申请号:US14190850
申请日:2014-02-26
CPC分类号: G01R31/048
摘要: Methods and systems for monitoring contact joint integrity in an information handling system may include precisely monitoring a change in resistance of a resistive element associated with a contact joint. The change in resistance of the resistive element may be indicative of the integrity of the contact joint. The resistance may be measured using a modulated current source and by demodulating a voltage signal resulting from the modulated current flowing across the resistive element.
摘要翻译: 用于监测信息处理系统中的接触接头完整性的方法和系统可以包括精确地监测与接触接头相关联的电阻元件的电阻变化。 电阻元件的电阻变化可以指示接触接头的完整性。 可以使用调制电流源来测量电阻,并且通过解调由流过电阻元件的调制电流产生的电压信号来测量电阻。
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公开(公告)号:US5196070A
公开(公告)日:1993-03-23
申请号:US815669
申请日:1991-12-31
申请人: Wallace H. Ables , Dwight R. Howle , John S. Humphrey , Robert G. Raines , Richard A. Reich , Robert A. Sorensen , Robert Valdez , Abdoul R. Zamani
发明人: Wallace H. Ables , Dwight R. Howle , John S. Humphrey , Robert G. Raines , Richard A. Reich , Robert A. Sorensen , Robert Valdez , Abdoul R. Zamani
IPC分类号: B23K35/22 , B23K35/36 , B23K35/363 , B23K35/40
CPC分类号: B23K35/36 , B23K35/3615 , B23K35/3618
摘要: A water soluble, thermally stable, solder flux for use in forming a water soluble, thermally stable, solder paste is provided. The water soluble, thermally stable, solder flux contains an acidic ester component having about 50% to about 60% monoesters by weight based on total weight, about 40% to about 50% diesters by weight based on total weight, and about 0% to about 1.5% phosphoric acid by weight based on total weight. This ester component is combined with triethanolamine to form a flux vehicle having a molar ratio of triethanolamine to the ester component of about 0.6 to about 1.2. This vehicle is present in the solder flux in an amount from about 68% to about 79% by weight based on total weight of solder flux. The flux also contains rheology adjusting components in an amount ranging from about 17% to about 26% by weight based on total weight of solder flux. Citric acid included in the flux in an amount ranging from about 4% to about 6% by weight based on total weight of solder flux.
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