公开(公告)号：US07733114B2

公开(公告)日：2010-06-08

申请号：US12255057

申请日：2008-10-21

Applicant: Chak Tong Albert Sze ,  Pei Wei Tsai ,  Sai Kit Wong ,  Wai Hong Sizto

Inventor： Chak Tong Albert Sze ,  Pei Wei Tsai ,  Sai Kit Wong ,  Wai Hong Sizto

IPC: G01R31/26

CPC classification number: G01R31/2893 ,  G01R31/2635

Abstract: A test handler is provided for testing electronic devices having light-emitting elements. Electronic devices are mounted at a loading position, optical measurements are conducted at a test contact position where a testing device is located for optical communication with the light-emitting elements and then tested electronic devices are removed at an unloading position. Multiple test contactors hold the electronic devices and move them to and through the loading position, test contact position and unloading position in sequence. Each test contactor comprises a device contact point including electrical conductors which are connected to electrical contacts of the electronic device when the electronic device is mounted at the device contact point, and a retaining mechanism grips the electronic device at the device contact point such that the retaining mechanism does not obstruct the optical communication between the testing device and the light-emitting element at the test contact position.

Abstract translation: 提供了一种用于测试具有发光元件的电子设备的测试处理器。 电子设备安装在加载位置，光学测量在测试设备所在的测试接触位置处进行，以与发光元件光学通信，然后在卸载位置移除测试的电子设备。 多个测试接触器握住电子设备，并将它们依次移动并穿过装载位置，测试接触位置和卸载位置。 每个测试接触器包括一个设备接触点，包括当电子设备安装在设备接触点时连接到电子设备的电触头的电导体，并且保持机构在设备接触点处夹持电子设备，使得保持 机构不会阻碍测试装置与测试接触位置处的发光元件之间的光通信。

公开(公告)号：US20100097083A1

公开(公告)日：2010-04-22

申请号：US12255057

申请日：2008-10-21

Applicant: Chak Tong Albert SZE ,  Pei Wei TSAI ,  Sai Kit WONG ,  Wai Hong SIZTO

Inventor： Chak Tong Albert SZE ,  Pei Wei TSAI ,  Sai Kit WONG ,  Wai Hong SIZTO

IPC: G01R31/28

CPC classification number: G01R31/2893 ,  G01R31/2635

Abstract: A test handler is provided for testing electronic devices having light-emitting elements. Electronic devices are mounted at a loading position, optical measurements are conducted at a test contact position where a testing device is located for optical communication with the light-emitting elements and then tested electronic devices are removed at an unloading position. Multiple test contactors hold the electronic devices and move them to and through the loading position, test contact position and unloading position in sequence. Each test contactor comprises a device contact point including electrical conductors which are connected to electrical contacts of the electronic device when the electronic device is mounted at the device contact point, and a retaining mechanism grips the electronic device at the device contact point such that the retaining mechanism does not obstruct the optical communication between the testing device and the light-emitting element at the test contact position.

Abstract translation: 提供了一种用于测试具有发光元件的电子设备的测试处理器。 电子设备安装在加载位置，光学测量在测试设备所在的测试接触位置处进行，以与发光元件光学通信，然后在卸载位置移除测试的电子设备。 多个测试接触器握住电子设备，并将它们依次移动并穿过装载位置，测试接触位置和卸载位置。 每个测试接触器包括一个设备接触点，包括当电子设备安装在设备接触点时连接到电子设备的电触头的电导体，并且保持机构在设备接触点处夹持电子设备，使得保持 机构不会阻碍测试装置与测试接触位置处的发光元件之间的光通信。

公开(公告)号：US08631923B1

公开(公告)日：2014-01-21

申请号：US13630071

申请日：2012-09-28

Applicant: Chak Tong Sze ,  Pei Wei Tsai ,  Wai Hong Sizto ,  Chunbai Wang ,  Wai Chuen Gan ,  Shing Wai Tam

Inventor： Chak Tong Sze ,  Pei Wei Tsai ,  Wai Hong Sizto ,  Chunbai Wang ,  Wai Chuen Gan ,  Shing Wai Tam

IPC: B65G37/00

CPC classification number: H01L21/67271 ,  B07C5/36

Abstract: A device sorting apparatus 100 is disclosed herein. In a described embodiment, the device sorting apparatus 100 comprises a plurality of bin connectors 120 for coupling to respective bins for storing sorted devices and a rotary distribution module 102 for receiving a device 200 to be sorted and for discharging the device 200 selectively into one of the bin connectors 120 to enable the device 200 to be unloaded to the respective bin. The device sorting apparatus 100 further comprises a sensor 110 coupled to the rotary distribution module 102 for detecting the discharge of the device 200, and which is rotatable together with the rotary distribution module 102; and a rotary transformer 400 for powering the sensor 110.

Abstract translation: 本文公开了一种装置分类装置100。 在所描述的实施例中，装置分类装置100包括多个箱连接器120，用于联接到相应的箱，用于存储分类装置;以及旋转分配模块102，用于接收待分类的装置200，并将装置200选择性地排放到 箱连接器120以使装置200能够卸载到相应的仓。 装置分拣装置100还包括耦合到旋转分配模块102的传感器110，用于检测装置200的排放，并与旋转分配模块102一起旋转; 以及用于为传感器110供电的旋转变压器400。

公开(公告)号：US20110248738A1

公开(公告)日：2011-10-13

申请号：US13079074

申请日：2011-04-04

Applicant: Chak Tong SZE ,  Pei Wei TSAI ,  Tin Yi CHAN ,  Wai Hong SIZTO ,  Cho Hin CHEUK

Inventor： Chak Tong SZE ,  Pei Wei TSAI ,  Tin Yi CHAN ,  Wai Hong SIZTO ,  Cho Hin CHEUK

IPC: G01R31/20 ,  H01L21/677

CPC classification number: G01R31/2893 ,  H01L21/68707 ,  H01L21/68728

Abstract: A wafer processing apparatus used for the testing of electronic devices comprises first and second clampers movably mounted on a shaft, each clamper being configured for holding a wafer carrier on which a wafer is mounted. Clamping fingers on each of the first and second clampers are operative to clamp onto the wafer carrier to hold the wafer carriers, and the clampers are operative to move the wafer carriers reciprocally between a loading position and a wafer processing location for processing the wafers.

Abstract translation: 用于电子设备测试的晶片处理设备包括可移动地安装在轴上的第一和第二夹具，每个夹持器构造成保持其上安装有晶片的晶片载体。 夹持在第一和第二夹具中的每一个上的手指可操作地夹紧到晶片载体上以保持晶片载体，并且夹具可操作以在加载位置和晶片加工位置之间往复移动晶片载体，以处理晶片。