Wafer processing apparatus having a tunable electrical resistivity
    1.
    发明授权
    Wafer processing apparatus having a tunable electrical resistivity 有权
    具有可调电阻率的晶片处理装置

    公开(公告)号:US07929269B2

    公开(公告)日:2011-04-19

    申请号:US12204079

    申请日:2008-09-04

    IPC分类号: H01T23/00

    摘要: An article with an etch resistant coating is disclosed. The article is a heating element, wafer carrier, or electrostatic chuck. The article has a base substrate made of a ceramic or other material, and further has one or more electrodes for resistance heating or electromagnetic chucking or both. The eth resistant coating has a plurality of regions made from materials having different electrical volume resistivities, such that the overall coating has a bulk resistivity that can be tailored by varying the relative size of each region.

    摘要翻译: 公开了具有耐蚀刻涂层的物品。 该物品是加热元件,晶片载体或静电卡盘。 该制品具有由陶瓷或其他材料制成的基底,并且还具有用于电阻加热或电磁夹持的两个或更多个电极。 耐腐蚀涂层具有由具有不同电体积电阻率的材料制成的多个区域,使得整个涂层具有可以通过改变每个区域的相对尺寸来调整的体电阻率。

    Methods for improving adhesion on dielectric substrates
    2.
    发明授权
    Methods for improving adhesion on dielectric substrates 有权
    改善电介质基片上粘附性的方法

    公开(公告)号:US09349392B1

    公开(公告)日:2016-05-24

    申请号:US13480278

    申请日:2012-05-24

    IPC分类号: G11B5/187 G11B5/31

    摘要: Various embodiments described herein provide for substrate structures including uniform plating seed layers, and that provide favorable adhesion on dielectric substrate layers. According to some embodiments, a methods for forming a magnetic recording pole is provided comprising: forming an insulator layer; forming a trench in the insulator layer; forming an amorphous seed layer over the insulator layer; forming an adhesion layer over the amorphous seed layer, the adhesion layer comprising a physical vapor deposited (PVD) noble metal; forming a plating seed layer over the adhesion layer, the plating seed layer comprising chemical vapor deposited (CVD) Ru; and forming a magnetic material layer over the plating seed layer.

    摘要翻译: 本文描述的各种实施例提供了包括均匀电镀种子层的衬底结构,并且在电介质衬底层上提供有利的粘附。 根据一些实施例,提供了一种用于形成磁记录极的方法,包括:形成绝缘体层; 在绝缘体层中形成沟槽; 在所述绝缘体层上形成无定形晶种层; 在所述无定形种子层上形成粘合层,所述粘合层包括物理气相沉积(PVD)贵金属; 在粘附层上形成电镀种子层,包括化学气相沉积(CVD)Ru的电镀种子层; 以及在所述电镀种子层上形成磁性材料层。

    WAFER PROCESSING APPARATUS HAVING A TUNABLE ELECTRICAL RESISTIVITY
    3.
    发明申请
    WAFER PROCESSING APPARATUS HAVING A TUNABLE ELECTRICAL RESISTIVITY 有权
    具有可调节电阻率的加工装置

    公开(公告)号:US20100053841A1

    公开(公告)日:2010-03-04

    申请号:US12204079

    申请日:2008-09-04

    IPC分类号: H01L21/683

    摘要: An article with an etch resistant coating is disclosed. The article is a heating element, wafer carrier, or electrostatic chuck. The article has a base substrate made of a ceramic or other material, and further has one or more electrodes for resistance heating or electromagnetic chucking or both. The eth resistant coating has a plurality of regions made from materials having different electrical volume resistivities, such that the overall coating has a bulk resistivity that can be tailored by varying the relative size of each region.

    摘要翻译: 公开了具有耐蚀刻涂层的物品。 该物品是加热元件,晶片载体或静电卡盘。 该制品具有由陶瓷或其他材料制成的基底,并且还具有用于电阻加热或电磁夹持的两个或更多个电极。 耐腐蚀涂层具有由具有不同电体积电阻率的材料制成的多个区域,使得整个涂层具有可以通过改变每个区域的相对尺寸来调整的体电阻率。

    Methods for tunable plating seed step coverage
    4.
    发明授权
    Methods for tunable plating seed step coverage 有权
    可调电镀种子步骤覆盖方法

    公开(公告)号:US08670213B1

    公开(公告)日:2014-03-11

    申请号:US13422997

    申请日:2012-03-16

    IPC分类号: G11B5/23 B44C1/22

    摘要: A writer main pole for a perpendicular magnetic recording system is provided. The writer pole has a tunable bottom gap to side gap ratio, and may be formed using deposition of a first seed layer through an ion beam deposition process, deposition of a second seed layer through a physical vapor deposition process, and deposition of a non-magnetic gap layer through a chemical vapor deposition process.

    摘要翻译: 提供了一种用于垂直磁记录系统的写入器主极。 写入器极具有可调节的底部间隙与侧面间隙比,并且可以通过通过离子束沉积工艺沉积第一种子层,通过物理气相沉积工艺沉积第二籽晶层, 磁隙层通过化学气相沉积工艺。