公开(公告)号：US08411443B2

公开(公告)日：2013-04-02

申请号：US13011283

申请日：2011-01-21

申请人： Wei-Hau Chen ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

发明人： Wei-Hau Chen ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

IPC分类号： H05K7/20

CPC分类号： G06F1/20

摘要： A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

摘要翻译： 散热组件包括粘附到存储器两侧的第一散热体和第二散热体。 第一散热体的底部边缘具有第一支撑件和包括第一止动部分和第一插入部分的第一接合件。 第二散热体的底部边缘具有第二支撑件和包括第二止动部分和第二插入部分的第二接合件。 第二插入部朝向第一插入部延伸。 第一插入部滑动地设置在第二停止部内。 第二插入件滑动地设置在第一停止部分内。 第一止动部与第二止挡部抵接，使第一卡合片和第二卡合片滑动接合。

公开(公告)号：US20120188707A1

公开(公告)日：2012-07-26

申请号：US13011283

申请日：2011-01-21

申请人： Wei-Hau CHEN ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

发明人： Wei-Hau CHEN ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

IPC分类号： G06F1/20

CPC分类号： G06F1/20

摘要： A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

摘要翻译： 散热组件包括粘附到存储器两侧的第一散热体和第二散热体。 第一散热体的底部边缘具有第一支撑件和包括第一止动部分和第一插入部分的第一接合件。 第二散热体的底部边缘具有第二支撑件和包括第二止动部分和第二插入部分的第二接合件。 第二插入部朝向第一插入部延伸。 第一插入部滑动地设置在第二停止部内。 第二插入件滑动地设置在第一停止部分内。 第一止动部与第二止挡部抵接，使第一卡合片和第二卡合片滑动接合。

公开(公告)号：USD659110S1

公开(公告)日：2012-05-08

申请号：US29358133

申请日：2010-03-23

申请人： Wei-Hau Chen ,  Cheng-Hsien Kuo

设计人： Wei-Hau Chen ,  Cheng-Hsien Kuo

公开(公告)号：US07661461B2

公开(公告)日：2010-02-16

申请号：US11819344

申请日：2007-06-27

申请人： Wei-Hau Chen

发明人： Wei-Hau Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/00 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device includes a base connected on a CPU and a pipe unit 2 includes a plurality of absorbing pipes which are engaged with the base. A plurality of cooling pipes are connected to two ends of the absorbing pipes and extend upward in V-shape. Two cooling units are connected to the cooling pipes and each cooling unit includes fins and a cooling fan which generates air flows toward the fins and cooling the parts around the CPU.

摘要翻译： 冷却装置包括连接在CPU上的基座和管单元2，其包括与基座接合的多个吸收管。 多个冷却管连接到吸收管的两端，并以V形向上延伸。 两个冷却单元连接到冷却管，并且每个冷却单元包括翅片和冷却风扇，其产生空气流向散热片并且冷却CPU周围的部件。

公开(公告)号：US20090288803A1

公开(公告)日：2009-11-26

申请号：US12155853

申请日：2008-06-11

申请人： Wei-Hau Chen ,  Steven Yen

发明人： Wei-Hau Chen ,  Steven Yen

IPC分类号： F28F7/00

CPC分类号： H01L23/3677 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

摘要翻译： 散热器包括第一热分配单元，其包括多个热分配板，在该分配板之间夹有芯片。 基板连接在第一热量分配单元的顶部，两个接合部分连接到基板的两端。 第二散热单元固定在基板的顶部上。 两个夹具将基板连接到第一个散热装置。 第二热分配单元可以是风扇，水冷单元或铝挤压构件。

公开(公告)号：US20090288804A1

公开(公告)日：2009-11-26

申请号：US12213595

申请日：2008-06-23

申请人： Wei-Hau Chen ,  Steven Yen

发明人： Wei-Hau Chen ,  Steven Yen

IPC分类号： F28F7/00

CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The clamping members each have a first portion fixed to the base board and a second board which is removably connected to the first portion. The second portion is connected to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

摘要翻译： 散热器包括第一热分配单元，其包括多个热分配板，在该分配板之间夹有芯片。 基板连接在第一热量分配单元的顶部，第二散热单元固定在基板的顶部。 基板通过两个夹紧构件连接到第一散热单元。 夹持构件各自具有固定到基板的第一部分和可移除地连接到第一部分的第二板。 第二部分连接到第一热分配单元。 第二热分配单元可以是风扇，水冷单元或铝挤压构件。

公开(公告)号：US07471514B2

公开(公告)日：2008-12-30

申请号：US11822046

申请日：2007-07-02

申请人： Wei-Hau Chen

发明人： Wei-Hau Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.

公开(公告)号：US20140111069A1

公开(公告)日：2014-04-24

申请号：US13656744

申请日：2012-10-22

申请人： Wei-Hau CHEN ,  Chen-Fong LIN

发明人： Wei-Hau CHEN ,  Chen-Fong LIN

IPC分类号： H05K7/10 ,  H05K5/03

CPC分类号： G06F1/187 ,  G06F1/1658

摘要： A housing structure for enclosing a solid-state drive (SSD) is disclosed. The housing structure includes a housing and a height adjustment plate. The housing is used for receiving the SSD and has a plurality of engagement recesses on a surface thereof. The height adjustment plate includes a plate body having a predetermined height and a plurality of hooks formed on the plate body. The hooks correspond to the engagement recesses in position and the height adjustment plate is fastened to the housing by engaging the hooks with the engagement recesses for adjusting an overall height of the SSD.

摘要翻译： 公开了一种用于封装固态驱动器（SSD）的外壳结构。 壳体结构包括壳体和高度调节板。 壳体用于接收SSD，并且在其表面上具有多个接合凹部。 高度调节板包括具有预定高度的板体和形成在板体上的多个钩。 钩对应于位置上的接合凹部，并且通过使钩与用于调节SSD的整体高度的接合凹部接合而将高度调节板紧固到壳体。

公开(公告)号：USD626521S1

公开(公告)日：2010-11-02

申请号：US29358136

申请日：2010-03-23

申请人： Wei-Hau Chen ,  Cheng-Hsien Kuo ,  Shih-Her Chen

设计人： Wei-Hau Chen ,  Cheng-Hsien Kuo ,  Shih-Her Chen

公开(公告)号：US20100188820A1

公开(公告)日：2010-07-29

申请号：US12360186

申请日：2009-01-27

申请人： Wei-Hau CHEN ,  Shih-Hsi Yen

发明人： Wei-Hau CHEN ,  Shih-Hsi Yen

IPC分类号： H05K7/20 ,  B21D39/00

CPC分类号： H01L23/36 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

摘要： A method for assembling memory module with heat dissipating sheet includes the flowing steps: providing a heat dissipating sheet; providing a memory module having a circuit board and at least one chip arranged on the circuit board; arranging the circuit board perpendicularly on the heat dissipating sheet; and folding at least a part of the heat dissipating sheet toward the chip and adhering the part of the heat dissipating sheet to the chip by the glue. Besides, an apparatus which the method of the present invention could perform on is also provided.

摘要翻译： 一种用于组装具有散热片的存储器模块的方法，包括流动步骤：提供散热片; 提供具有电路板的存储器模块和布置在电路板上的至少一个芯片; 将电路板垂直布置在散热板上; 并且将散热片的至少一部分折叠到所述芯片上，并且通过所述胶将所述散热片的所述一部分粘附到所述芯片。 此外，还提供了本发明的方法可以执行的装置。