公开(公告)号：US07685733B2

公开(公告)日：2010-03-30

申请号：US11566377

申请日：2006-12-04

Applicant: Hitoshi Ohmori ,  Yutaka Watanabe ,  Shinya Morita ,  Yoshihiro Uehara ,  Weimin Lin ,  Kazutoshi Katahira

Inventor： Hitoshi Ohmori ,  Yutaka Watanabe ,  Shinya Morita ,  Yoshihiro Uehara ,  Weimin Lin ,  Kazutoshi Katahira

IPC: G01B7/00

CPC classification number: G01B7/012 ,  G01B3/008 ,  G01B5/012 ,  G01B11/007

Abstract: There is disclosed a micro surface shape measurement probe including a probe shaft 4 having at a distant end thereof a probe member 2 for contacting an object 1 to be measured, a probe body 21 provided with support means for movably supporting the probe shaft 4 in a non-contact manner, a pressing device for pressing and moving the probe shaft 4 toward the object 1 to be measured, a piezoelectric sensor 8a incorporated in the probe body 21 so that a reactive force acts to a pressing force applied to the probe shaft by the pressing device, a load detecting device 8b to measure a load acting on the piezoelectric sensor, a control device 9 for adjusting the pressing force applied by the pressing device based on the load detected by the load detecting device, and a displacement amount measuring device for measuring a position of the probe member 2 in contact with the object 1 to be measured by the pressing force adjusted by the control device 9.

Abstract translation: 公开了一种微型表面形状测量探针，其包括探针轴4，探针轴4的远端具有用于接触被测量物体1的探针构件2，探针体21，其设置有用于将探针轴4可移动地支撑在一起的支撑装置 用于将探针轴4朝向要测量的物体1按压和移动的按压装置，结合在探针主体21中的压电传感器8a，使得反作用力作用于通过施加到探针轴的按压力 按压装置，用于测量作用在压电传感器上的负载的负载检测装置8b，用于基于由负载检测装置检测到的负载来调节由加压装置施加的按压力的控制装置9和位移量测量装置 用于通过由控制装置9调节的按压力来测量与被测量物体1接触的探针部件2的位置。

公开(公告)号：US20070126314A1

公开(公告)日：2007-06-07

申请号：US11566377

申请日：2006-12-04

Applicant: Hitoshi Ohmori ,  Yutaka Watanabe ,  Shinya Morita ,  Yoshihiro Uehara ,  Weimin Lin ,  Kazutoshi Katahira

Inventor： Hitoshi Ohmori ,  Yutaka Watanabe ,  Shinya Morita ,  Yoshihiro Uehara ,  Weimin Lin ,  Kazutoshi Katahira

IPC: H01L41/00

CPC classification number: G01B7/012 ,  G01B3/008 ,  G01B5/012 ,  G01B11/007

Abstract: There is disclosed a micro surface shape measurement probe including a probe shaft 4 having at a distant end thereof a probe member 2 for contacting an object 1 to be measured, a probe body 21 provided with support means for movably supporting the probe shaft 4 in a non-contact manner, a pressing device for pressing and moving the probe shaft 4 toward the object 1 to be measured, a piezoelectric sensor 8a incorporated in the probe body 21 so that a reactive force acts to a pressing force applied to the probe shaft by the pressing device, a load detecting device 8b to measure a load acting on the piezoelectric sensor, a control device 9 for adjusting the pressing force applied by the pressing device based on the load detected by the load detecting device, and a displacement amount measuring device for measuring a position of the probe member 2 in contact with the object 1 to be measured by the pressing force adjusted by the control device 9.

Abstract translation: 公开了一种微型表面形状测量探针，其包括探针轴4，探针轴4的远端具有用于接触被测量物体1的探针构件2，探针体21，其设置有用于将探针轴4可移动地支撑在一起的支撑装置 用于将探针轴4朝向待测量物体1按压并移动的按压装置，结合在探针体21中的压电传感器8，使得反作用力作用于施加到探针轴的压力 通过按压装置，用于测量作用在压电传感器上的负载的负载检测装置8b，用于基于由负载检测装置检测到的负载来调整由加压装置施加的按压力的控制装置9和位移量 测量装置，用于通过由控制装置9调节的按压力来测量与待测量物体1接触的探针构件2的位置。

公开(公告)号：US20050158965A1

公开(公告)日：2005-07-21

申请号：US11047476

申请日：2005-01-31

Applicant: Jingyi Bai ,  Weimin Lin ,  William Budge

Inventor： Jingyi Bai ,  Weimin Lin ,  William Budge

IPC: H01L21/762 ,  H01L21/76 ,  H01L21/4763

CPC classification number: H01L21/76224 ,  H01L21/76229

Abstract: Methods of filling high aspect ratio trenches in semiconductor layers are provided. The methods utilize HDP-CVD processes to fill trenches with trench filling material. In the methods, the gas flow and RF bias are selected to provide a high etch to deposition ratio, while the trenches are partially filled. The gas flow and RF bias are then selected to provide a low etch to deposition ratio while the trenches are completely filled. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that is will not be used to interpret or limit the scope or meaning of the claims.

公开(公告)号：US08500988B2

公开(公告)日：2013-08-06

申请号：US12294710

申请日：2006-09-08

Applicant: Weimin Lin ,  Hitoshi Ohmori ,  Yasutaka Yamamoto ,  Jiro Maruyama

Inventor： Weimin Lin ,  Hitoshi Ohmori ,  Yasutaka Yamamoto ,  Jiro Maruyama

IPC: B23H3/00 ,  B23H5/00 ,  B23H7/00 ,  B23H9/00 ,  B23H11/00 ,  C25F3/00 ,  C25F7/00 ,  H05K3/07 ,  B24B1/00 ,  B24B7/19 ,  B24B7/30

CPC classification number: B24B53/001 ,  B24B33/02 ,  B24B33/083 ,  B24B53/12

Abstract: An ELID honing device includes a honing tool 10 positioned above a workpiece 1 having a hollow cylindrical inner surface, and vertically movable and rotationally drivable about a vertical rotation axis while being rockably suspended from an upper end, and a honing guide 20 positioned in proximity to an upper portion of the workpiece to guide the honing tool to the hollow cylindrical inner surface. The honing tool 10 has a fixed guide 12 having a predetermined radius R from the rotation axis to its outer peripheral surface, and honing stones 14a and 14b having outer peripheral surfaces movable in parallel from a diameter-increased position outside the radius R to a diameter-reduced position inside the radius R and capable of being electrolytically dressed. Further, the honing guide 20 has a hollow cylindrical ELID electrode 22 having an inner surface 22a for guiding an outer peripheral surface of the fixed guide of the honing tool and capable of being subjected to a negative voltage.

Abstract translation: ELID珩磨装置包括一个珩磨工具10，该珩磨工具10位于具有中空圆柱形内表面的工件1上方，并且可垂直移动并围绕垂直旋转轴可旋转地驱动，同时从上端可摆动地悬挂;以及珩磨引导件20， 工件的上部，以将珩磨工具引导到中空圆柱形内表面。 珩磨工具10具有从旋转轴线到其外周面的具有预定半径R的固定引导件12，以及具有从半径R外侧的直径增加位置平行移动的外周表面的珩磨石14a和14b， - 减小半径R内的位置，并能够进行电解穿戴。 此外，珩磨引导件20具有中空的圆柱形ELID电极22，其具有内表面22a，用于引导珩磨工具的固定引导件的外周表面并且能够承受负电压。

公开(公告)号：US20100240284A1

公开(公告)日：2010-09-23

申请号：US12294710

申请日：2006-09-08

Applicant: Weimin Lin ,  Hitoshi Ohmori ,  Yasutaka Yamamoto ,  Jiro Maruyama

Inventor： Weimin Lin ,  Hitoshi Ohmori ,  Yasutaka Yamamoto ,  Jiro Maruyama

IPC: B24B1/00 ,  B24B33/02

CPC classification number: B24B53/001 ,  B24B33/02 ,  B24B33/083 ,  B24B53/12

Abstract: An ELID honing device includes a honing tool 10 positioned above a workpiece 1 having a hollow cylindrical inner surface, and vertically movable and rotationally drivable about a vertical rotation axis while being rockably suspended from an upper end, and a honing guide 20 positioned in proximity to an upper portion of the workpiece to guide the honing tool to the hollow cylindrical inner surface. The honing tool 10 has a fixed guide 12 having a predetermined radius R from the rotation axis to its outer peripheral surface, and honing stones 14a and 14b having outer peripheral surfaces movable in parallel from a diameter-increased position outside the radius R to a diameter-reduced position inside the radius R and capable of being electrolytically dressed. Further, the honing guide 20 has a hollow cylindrical ELID electrode 22 having an inner surface 22a for guiding an outer peripheral surface of the fixed guide of the honing tool and capable of being subjected to a negative voltage.

Abstract translation: ELID珩磨装置包括一个珩磨工具10，该珩磨工具10位于具有中空圆柱形内表面的工件1上方，并且可垂直移动并围绕垂直旋转轴可旋转地驱动，同时从上端可摆动地悬挂;以及珩磨引导件20， 工件的上部，以将珩磨工具引导到中空圆柱形内表面。 珩磨工具10具有从旋转轴线到其外周面的具有预定半径R的固定引导件12，以及具有从半径R外侧的直径增加位置平行移动的外周表面的珩磨石14a和14b， - 减小半径R内的位置，并且能够被电解。 此外，珩磨引导件20具有中空的圆柱形ELID电极22，其具有内表面22a，用于引导珩磨工具的固定引导件的外周表面并且能够承受负电压。

公开(公告)号：US20080067704A1

公开(公告)日：2008-03-20

申请号：US11577214

申请日：2005-10-18

Applicant: Hitoshi Ohmori ,  Yoshihiro Uehara ,  Weimin Lin ,  Hatsuichi Takeyasu ,  Masao Washio ,  Keizo Ikegami ,  Takeya Shoji ,  Tomoaki Ando ,  Yukihiro Shirataki

Inventor： Hitoshi Ohmori ,  Yoshihiro Uehara ,  Weimin Lin ,  Hatsuichi Takeyasu ,  Masao Washio ,  Keizo Ikegami ,  Takeya Shoji ,  Tomoaki Ando ,  Yukihiro Shirataki

IPC: B29C43/18

CPC classification number: B29C43/08 ,  B29B11/12 ,  B29C31/008 ,  B29C35/0266 ,  B29C35/16 ,  B29C43/021 ,  B29C43/34 ,  B29C59/022 ,  B29C2043/3433 ,  B29C2043/3444 ,  B29C2043/3618 ,  B29C2043/3634 ,  B29C2043/563 ,  B29C2059/023 ,  B29C2791/001 ,  B29K2105/251 ,  B29L2011/00 ,  B29L2011/0016

Abstract: The micro-molding equipment contains a preform molding equipment 10 taking a single-cavity of a preform material 3 corresponding to a small precision optical component to be molded with a runnerless mold, and a precision compression molding equipment 40 for after molding the preform material 3 by primary compression molding in a vacuum state, cooling the preform material to a temperature near a glass transition point, and then re-softening a surface layer of the preform material and molding the same by secondary compression molding to transfer the small precision optical component thereto.

Abstract translation: 微型成型设备包含预成型件成型设备10，该预制件成形设备10采用预成型材料3的单腔，对应于用无浇道模具成型的小型精密光学部件，以及用于模制预成型材料3之后的精密压缩成型设备40 通过在真空状态下的初级压缩成型，将预成型体材料冷却至接近玻璃化转变点的温度，然后对预成型体材料的表面层进行再软化，并通过二次压缩成型将其成型，将小型精密光学部件转印到 。