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公开(公告)号:US06170171B2
公开(公告)日:2001-01-09
申请号:US09207496
申请日:1998-12-08
申请人: Wilhelm Schmidbauer , Hanns Wochner , Werner Ott
发明人: Wilhelm Schmidbauer , Hanns Wochner , Werner Ott
IPC分类号: F26B504
CPC分类号: F26B5/04
摘要: A method and apparatus for drying semiconductor fragment material, has at least one vacuum-tight chamber with at least one receiving means for semiconductor fragment material, and there is a means for maintaining a vacuum in the apparatus.
摘要翻译: 用于干燥半导体碎片材料的方法和装置具有至少一个具有至少一个用于半导体碎片材料的接收装置的真空密封室,并且存在用于在该装置中保持真空的装置。
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2.
公开(公告)号:US5275072A
公开(公告)日:1994-01-04
申请号:US979294
申请日:1992-11-20
申请人: Karlheinz Schmid , Heinrich Bonfert , Werner Ott , Bernd Faigle
发明人: Karlheinz Schmid , Heinrich Bonfert , Werner Ott , Bernd Faigle
IPC分类号: B23B5/22 , B23B31/163 , B23Q1/76
CPC分类号: B23Q1/763 , B23B31/16004 , Y10T82/19 , Y10T82/2597
摘要: A center drive support for supporting a crankshaft during machining in a machining device comprises a rotatably drivable support member and a drive unit. The rotatably drivable support member has a carrier with at least two clamping elements with clamping ends. The clamping elements are displaceable between a clamping position and a release position for the crankshaft. The clamping elements clamp the crankshaft between their clamping ends. The drive unit is connected to the clamping elements for applying a required clamping force in the clamping position during rotation of the support member. The drive unit includes a clamping motor and a drive shaft connected to the clamping motor. It further includes a gear unit connected between the drive shaft and the carrier. The gear unit, during machining of the crankshaft in the clamping position, follows the rotation of the support member against the toque of the clamping motor.
摘要翻译: 用于在加工装置中加工期间支撑曲轴的中心驱动支撑件包括可旋转地驱动的支撑构件和驱动单元。 可旋转地驱动的支撑构件具有带有至少两个具有夹紧端的夹紧元件的载体。 夹紧元件可在夹紧位置和曲轴的释放位置之间移动。 夹紧元件将曲轴夹在其夹紧端之间。 驱动单元连接到夹持元件,用于在支撑构件的旋转期间在夹紧位置施加所需的夹紧力。 驱动单元包括夹紧马达和连接到夹紧马达的驱动轴。 它还包括连接在驱动轴和载体之间的齿轮单元。 减速器在夹紧位置的曲轴加工过程中,跟随着支撑构件相对于夹紧马达的扭矩的旋转。
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公开(公告)号:US06309467B1
公开(公告)日:2001-10-30
申请号:US09153197
申请日:1998-09-15
申请人: Hanns Wochner , Theresia Bauer , Josef Dietl , Werner Ott , Herbert Pichler , Wilhelm Schmidbauer , Dieter Seifert , Susanne Weizbauer
发明人: Hanns Wochner , Theresia Bauer , Josef Dietl , Werner Ott , Herbert Pichler , Wilhelm Schmidbauer , Dieter Seifert , Susanne Weizbauer
IPC分类号: C23G102
CPC分类号: H01L21/02052 , C01B33/037
摘要: Semiconductor material has a low metal concentration at the surface. The semiconductor material has an iron content and/or chromium content on the surface of less than 6.66×10−11 g/cm2. A method for producing this semiconductor material includes a preliminary cleaning, a main cleaning and hydrophilization. A device for use in this method has a container with pyramid-shaped recesses at the bottom.
摘要翻译: 半导体材料在表面具有低的金属浓度。 半导体材料的表面上的铁含量和/或铬含量小于6.66×10-11g / cm 2。 制造该半导体材料的方法包括预清洗,主清洗和亲水化。 在该方法中使用的装置具有在底部具有棱锥形凹部的容器。
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