公开(公告)号：US6043972A

公开(公告)日：2000-03-28

申请号：US40059

申请日：1998-03-17

Applicant: Wolfgang Westermann

Inventor： Wolfgang Westermann

IPC: H01G4/18 ,  H01G2/06 ,  H01G2/10 ,  H01G2/20 ,  H01G4/00 ,  H01G4/224 ,  H01G4/228 ,  H01G4/32

CPC classification number: H01G2/106 ,  H01G2/065

Abstract: Film capacitor of a film/foil or metallized embodiment with a wound or layered structure with a cup sheath or sheath made of thermosetting plastic material with axial or radial connecting wires, in which the sheathed film capacitor, which is a finished component once all the electrical parameters have been tested, is accommodated in a second sheath, which is designed as a cup, and the connecting wires are bent around onto mutually opposite outer sides of this second cup sheath and are in each connected to a connecting metal-sheet section.

Abstract translation: 膜/箔或金属化实施例的薄膜电容器具有卷绕或分层结构，其具有由具有轴向或径向连接线的热固性塑料材料制成的杯套或护套，其中所述护套膜电容器是所有电气 参数已被测试，被容纳在设计为杯的第二护套中，并且连接线围绕第二杯套的相对的外侧弯曲，并且各自连接到连接金属片部分。

公开(公告)号：US20220293341A1

公开(公告)日：2022-09-15

申请号：US17638791

申请日：2020-08-19

Applicant: WOLFGANG WESTERMANN

Inventor： AXEL WESTERMANN

IPC: H01G2/10 ,  H01G4/38 ,  H01G4/32 ,  H01G4/232

Abstract: The invention relates to a film capacitor for power electronics, which comprises a first electrically conductive layer, which is arranged on a first end side face of the film capacitor, wherein the surface normal of the first electrically conductive layer is perpendicular to the surface normals of dielectric films of the film capacitor. A second electrically conductive layer is arranged on a second end side face opposite from the first end side face, wherein the surface normal of the second electrically conductive layer is perpendicular to the surface normals of the dielectric films of the film capacitor. The film capacitor has at least one inner passage, which extends from the first electrically conductive layer to the second electrically conductive layer, wherein the passage is formed by removal of capacitor material. The invention also relates to a capacitor assembly.

公开(公告)号：US11942274B2

公开(公告)日：2024-03-26

申请号：US17638791

申请日：2020-08-19

Applicant: Wolfgang Westermann

Inventor： Axel Westermann

IPC: H01G2/10 ,  H01G4/232 ,  H01G4/32 ,  H01G4/38

CPC classification number: H01G2/106 ,  H01G4/232 ,  H01G4/32 ,  H01G4/38

Abstract: The invention relates to a film capacitor for power electronics, which comprises a first electrically conductive layer, which is arranged on a first end side face of the film capacitor, wherein the surface normal of the first electrically conductive layer is perpendicular to the surface normals of dielectric films of the film capacitor. A second electrically conductive layer is arranged on a second end side face opposite from the first end side face, wherein the surface normal of the second electrically conductive layer is perpendicular to the surface normals of the dielectric films of the film capacitor. The film capacitor has at least one inner passage, which extends from the first electrically conductive layer to the second electrically conductive layer, wherein the passage is formed by removal of capacitor material. The invention also relates to a capacitor assembly.

公开(公告)号：US4656556A

公开(公告)日：1987-04-07

申请号：US804625

申请日：1985-12-05

Applicant: Wolfgang Westermann

Inventor： Wolfgang Westermann

IPC: H01G20060101 ,  H01G2/06 ,  H01G4/32 ,  H01G7/00 ,  H01G1/13 ,  H01G1/14

CPC classification number: H01G2/06 ,  H01G2/065 ,  Y10T29/435

Abstract: A plastic-film wound capacitor having a cast resin, cast-coated cup encapsulation and connecting wires which radially make contact with the wound capacitor body can be simply and economically manufactured in chip configuration. The connecting wires of the chip capacitor are bent through 180.degree. and connected, respectively, to a sheet metal section on the outside of the cup encapsulation.

Abstract translation: 可以简单且经济地制造具有铸造树脂，铸塑杯封装和与卷绕的电容器主体接触的连接线的塑料薄膜卷绕电容器。 芯片电容器的连接线弯曲180°并分别连接到杯状封装外侧的金属板部分。

公开(公告)号：US4578737A

公开(公告)日：1986-03-25

申请号：US617014

申请日：1984-06-04

Applicant: Wolfgang Westermann

Inventor： Wolfgang Westermann

IPC: H01G2/06 ,  H01G2/12 ,  H01G4/08 ,  H01G7/00 ,  H01G1/13

CPC classification number: H01G2/06 ,  H01G2/065 ,  H01G2/12 ,  H01G4/224 ,  H01G4/228 ,  Y10T29/435

Abstract: Disclosed is a synthetic resin film wound capacitor, in particular a flat wound capacitor in a chip configuration, comprising a casing of a material that retains its shape under the effect of heat, for example a thermosetting synthetic resin, and connecting elements of a thin sheet metal attached to the ends of the capacitor such that sections of which project from the casing and are angled with respect to the frontal side of the capacitor. This synthetic resin film capacitor in a chip configuration resists thermal stresses during the overhead soldering of assembled printed circuits and therefore extends the possible applications of synthetic resin film capacitors. Also disclosed is a process for the manufacture of a capacitor according to the present invention.

Abstract translation: 公开了一种合成树脂薄膜缠绕电容器，特别是片状构造的扁平卷绕电容器，其包括在热作用下保持其形状的材料的壳体，例如热固性合成树脂，以及薄片的连接元件 金属附接到电容器的端部，使得其部分从壳体突出并且相对于电容器的正面成一定角度。 该芯片构造的合成树脂薄膜电容器在组装的印刷电路的架空焊接期间抵抗热应力，因此延长了合成树脂薄膜电容器的可能应用。 还公开了根据本发明的制造电容器的方法。