Imaging system and method for producing semiconductor structures on a wafer by imaging a mask on the wafer with a dipole diaphragm
    2.
    发明申请
    Imaging system and method for producing semiconductor structures on a wafer by imaging a mask on the wafer with a dipole diaphragm 审中-公开
    通过用偶极子膜片将晶片上的掩模成像在晶片上制造半导体结构的成像系统和方法

    公开(公告)号:US20060183258A1

    公开(公告)日:2006-08-17

    申请号:US11334941

    申请日:2006-01-19

    IPC分类号: G06F17/50 H01L21/00

    摘要: An imaging system having a dipole diaphragm (2) having two diaphragm openings (2b) arranged one behind the other in a dipole axis (y), and a mask having mask structures (20, 23) is used for producing semiconductor structures (10′, 13′) on a wafer (15′) by imaging the mask (25) onto the wafer (15′). The dipole diaphragm (2) is provided for the imaging of the mask (25), and the mask (25), for producing main semiconductor structures (10; 10′) on the wafer (15′), has main mask structures (20) parallel to an imaging axis (x) running perpendicular to the dipole axis (y). At least one connecting mask structure (23′) oriented obliquely with respect to the dipole axis (y) at least in sections is formed on the mask (25), which structure connects at least two main mask structures (20) to one another.

    摘要翻译: 一种具有偶极子(2)的成像系统,其具有在偶极轴(y)中一个彼此排列的两个隔膜开口(2b)和具有掩模结构(20,23)的掩模,用于制造半导体结构 ',13')通过将掩模(25)成像到晶片(15')上而在晶片(15')上。 提供偶极隔膜(2)用于掩模(25)的成像,并且用于在晶片(15')上制造主半导体结构(10; 10')的掩模(25)具有主掩模结构(20 )平行于垂直于偶极轴(y)延伸的成像轴(x)。 在掩模(25)上形成至少一部分相对于偶极轴(y)倾斜定向的至少一个连接掩模结构(23'),该结构将至少两个主掩模结构(20)彼此连接。

    Method for producing semiconductor patterns on a wafer
    3.
    发明申请
    Method for producing semiconductor patterns on a wafer 审中-公开
    在晶片上制造半导体图案的方法

    公开(公告)号:US20060177773A1

    公开(公告)日:2006-08-10

    申请号:US11335152

    申请日:2006-01-19

    IPC分类号: G03F7/00

    摘要: A method is used to produce semiconductor patterns (10′, 13′) on a wafer (15′). For this purpose, a mask (25) and a dipole aperture (2) with two aperture openings (2b) arranged behind one another in a dipole axis (y) are used. The mask (25) is imaged on the wafer (15′) by means of the dipole aperture (2) and, by the imaging of the mask (25) on the wafer (15′), main semiconductor patterns (10′) are produced which are aligned perpendicularly to the dipole axis (y) and in parallel with an imaging axis (x). A second mask (35) with at least one connecting mask pattern (33) is imaged on the wafer (15′) by means of a second aperture (6), as a result of which a connecting semiconductor pattern (13) is produced on the wafer (15′), by means of which at least two of the main semiconductor patterns (10′) are connected to one another.

    摘要翻译: 使用一种方法来在晶片(15')上产生半导体图案(10',13')。 为此,使用具有在偶极轴(y)中彼此相邻布置的两个开口开口(2b)的掩模(25)和偶极孔(2)。 通过偶极孔(2)将掩模(25)成像在晶片(15')上,并且通过在晶片(15')上的掩模(25)的成像,主半导体图案(10') 产生的垂直于偶极轴(y)并与成像轴(x)平行排列。 具有至少一个连接掩模图案(33)的第二掩模(35)通过第二孔(6)被成像在晶片(15')上,结果在其上产生连接半导体图案(13) 所述晶片(15')通过所述晶片(15')中的至少两个所述主半导体图案(10')彼此连接。