摘要:
Termination structure for a pattern, especially an at least partially regular spaced pattern used in the manufacturing of semiconductor devices, especially DRAM-chips, wherein the termination structure comprises at least a first line-shaped element and at least one extension element adjacent to the first line-shaped element partially increasing the width of the first line-shaped element.
摘要:
An imaging system having a dipole diaphragm (2) having two diaphragm openings (2b) arranged one behind the other in a dipole axis (y), and a mask having mask structures (20, 23) is used for producing semiconductor structures (10′, 13′) on a wafer (15′) by imaging the mask (25) onto the wafer (15′). The dipole diaphragm (2) is provided for the imaging of the mask (25), and the mask (25), for producing main semiconductor structures (10; 10′) on the wafer (15′), has main mask structures (20) parallel to an imaging axis (x) running perpendicular to the dipole axis (y). At least one connecting mask structure (23′) oriented obliquely with respect to the dipole axis (y) at least in sections is formed on the mask (25), which structure connects at least two main mask structures (20) to one another.
摘要:
A method is used to produce semiconductor patterns (10′, 13′) on a wafer (15′). For this purpose, a mask (25) and a dipole aperture (2) with two aperture openings (2b) arranged behind one another in a dipole axis (y) are used. The mask (25) is imaged on the wafer (15′) by means of the dipole aperture (2) and, by the imaging of the mask (25) on the wafer (15′), main semiconductor patterns (10′) are produced which are aligned perpendicularly to the dipole axis (y) and in parallel with an imaging axis (x). A second mask (35) with at least one connecting mask pattern (33) is imaged on the wafer (15′) by means of a second aperture (6), as a result of which a connecting semiconductor pattern (13) is produced on the wafer (15′), by means of which at least two of the main semiconductor patterns (10′) are connected to one another.