Heat dissipating device and method for manufacturing it

    公开(公告)号:US20060034058A1

    公开(公告)日:2006-02-16

    申请号:US11015984

    申请日:2004-12-17

    IPC分类号: H05K7/20

    摘要: A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.

    Heat dissipating device and method for manufacturing it
    2.
    发明授权
    Heat dissipating device and method for manufacturing it 失效
    散热装置及其制造方法

    公开(公告)号:US07142426B2

    公开(公告)日:2006-11-28

    申请号:US11015984

    申请日:2004-12-17

    IPC分类号: H05K7/20

    摘要: A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.

    摘要翻译: 散热装置包括在其上形成按压部的散热片和夹子。 散热器包括中空的散热构件和柱状芯,并且夹具包括在其中限定圆孔的整体形成的主体。 按压部分延伸超过夹子并将夹子的主体按压在散热器上。 如上所述的制造散热装置的方法包括以下步骤:提供具有形成在其上的轴环的散热器; 在衣架上延伸超过夹子提供散热器上的夹子; 使得衣领在压力下变形以形成将夹子压在散热器上的按压部分。

    Memory module assembly with heat dissipation device
    3.
    发明授权
    Memory module assembly with heat dissipation device 失效
    带散热装置的内存组件

    公开(公告)号:US07755897B2

    公开(公告)日:2010-07-13

    申请号:US11964896

    申请日:2007-12-27

    IPC分类号: H05K7/20 H01L23/36

    摘要: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.

    摘要翻译: 存储模块组件(100)包括具有右侧表面(240)和左侧表面(220),散热器(400)和热管(500)的存储卡(200)。 散热器包括附接到存储卡的左侧表面的基座构件(420)和附接到存储卡的右侧表面并联接到基座构件的外壳(440)。 基座部件包括安装在存储卡的左侧表面上的基板部分(422)和从基板部分延伸并支撑在存储卡的顶部边缘上的支撑部分(424)。 热管包括与外壳和基板部分中的一个热接合的蒸发器(520)和与支撑部分热接合的冷凝器(540)。

    Heat dissipation device
    4.
    发明申请
    Heat dissipation device 失效
    散热装置

    公开(公告)号:US20050207118A1

    公开(公告)日:2005-09-22

    申请号:US11020080

    申请日:2004-12-21

    IPC分类号: H01L23/34 H01L23/467 H05K7/20

    摘要: A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.

    摘要翻译: 散热装置包括散热器(50)和位于散热器上方的用于提供气流的风扇(10)。 散热器包括设置在基座上的基座(40)和散热部(30)。 散热部件包括多个翅片(31),每个相邻的翼片在它们之间限定通道(35)。 散热部分限定了多个通道(34),该通道相对于通道对角设置并垂直于通道。 通道和通道与风扇的气流一致。

    Heat dissipation device
    5.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号:US07139171B2

    公开(公告)日:2006-11-21

    申请号:US11020080

    申请日:2004-12-21

    IPC分类号: H05K7/20

    摘要: A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.

    摘要翻译: 散热装置包括散热器(50)和位于散热器上方的用于提供气流的风扇(10)。 散热器包括设置在基座上的基座(40)和散热部(30)。 散热部件包括多个翅片(31),每个相邻的翼片在它们之间限定通道(35)。 散热部分限定了多个通道(34),该通道相对于通道对角设置并垂直于通道。 通道和通道与风扇的气流一致。

    Radiator with airflow guiding structure
    6.
    发明授权
    Radiator with airflow guiding structure 有权
    散热器带气流引导结构

    公开(公告)号:US06973962B2

    公开(公告)日:2005-12-13

    申请号:US10892641

    申请日:2004-07-16

    IPC分类号: H01L23/467 F28F7/00

    摘要: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.

    摘要翻译: 散热器包括传热基座(30),固定到传热基座的散热构件(20)和安装到散热构件的风扇(50)。 散热构件包括用于散热的多个翅片(22)。 为了提高散热器的散热效率,在翅片之间形成引导结构,用于将空气从风扇引导到传热基体的中间部分和散热构件的中部底部。

    Cooling fan
    7.
    发明授权
    Cooling fan 有权
    冷风扇

    公开(公告)号:US07745967B2

    公开(公告)日:2010-06-29

    申请号:US11959280

    申请日:2007-12-18

    IPC分类号: H02K5/10 H02K5/16

    摘要: A cooling fan includes a fan housing (10) having a central tube (102) extending upwardly therefrom, a bearing (40) received in the central tube, a stator (20) mounted around the central tube, a rotor (30), and a cover (50). The bearing defines a bearing hole (47) therein. The rotor includes a hub (32), a plurality of blades (34) extending outwardly from the hub, and a shaft (36) extending downwardly from the hub into the bearing hole of the bearing. The cover is mounted around the shaft and arranged on the bearing to seal a top end of the bearing. The cover is made of powders by sintering and thus has a plurality of pores to generate capillary force to absorb lubricant oil leaking out of the bearing.

    摘要翻译: 冷却风扇包括具有从其向上延伸的中心管(102)的风扇壳体(10),容纳在中心管中的轴承(40),围绕中心管安装的定子(20),转子(30),以及 盖(50)。 该轴承在其中限定一个轴承孔(47)。 转子包括轮毂(32),从轮毂向外延伸的多个叶片(34)和从轮毂向下延伸到轴承的轴承孔的轴(36)。 盖安装在轴上并布置在轴承上以密封轴承的顶端。 盖通过烧结由粉末制成,因此具有多个孔以产生毛细管力以吸收从轴承泄漏的润滑油。

    LED illumination device
    8.
    发明授权
    LED illumination device 失效
    LED照明装置

    公开(公告)号:US08053960B2

    公开(公告)日:2011-11-08

    申请号:US12406095

    申请日:2009-03-17

    IPC分类号: F21V29/00

    摘要: An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.

    摘要翻译: LED照明装置包括设置在LED照明装置的底端的光学部,​​并且设置有光源。 位于光学部分附近的散热部包括与光源热接触的多个散热片。 电气部分设置在LED照明装置的顶端并与光源电连接。 散热部设置在光学部和电部之间。 电气部分限定了将电气部分的内部与散热部分连通的多个空气交换器和将电气部分的内部与LED照明装置的外部环境连通的多个排气口。

    METHOD FOR COMBINING COMPONENTS MADE OF DIFFERENT MATERIALS
    9.
    发明申请
    METHOD FOR COMBINING COMPONENTS MADE OF DIFFERENT MATERIALS 审中-公开
    用于组合不同材料组分的方法

    公开(公告)号:US20060124205A1

    公开(公告)日:2006-06-15

    申请号:US11163425

    申请日:2005-10-18

    IPC分类号: C22F1/00 C22F1/04 C22F1/08

    CPC分类号: C22F1/04 C22F1/00 C22F1/08

    摘要: A method for combining two components together includes the following steps: a) surface treating the two components; b) placing them within a heating apparatus while they contact with each other, a force being applied to the two components to push then against each other on the contacting surfaces thereof; c) heating the two components to a predetermined temperature which is hold for a predetermined period time to cause the two components to diffuse at the contacting interface to thereby combine the two components together; d) cooling the combined two components and taking them out of the heating apparatus.

    摘要翻译: 将两个组分组合在一起的方法包括以下步骤:a)对两种组分进行表面处理; b)当它们彼此接触时将它们放置在加热设备内,施加到两个部件上的力在其接触表面上相互推压; c)将两个部件加热到预定温度,该预定温度保持预定的时间段以使两个部件在接触界面处扩散,从而将两个部件组合在一起; d)冷却组合的两个部件并将其从加热装置中取出。