公开(公告)号：US20110222314A1

公开(公告)日：2011-09-15

申请号：US13043790

申请日：2011-03-09

Applicant: KUO-CHI LIU ,  NAN-MING CHEN ,  YONG-CHIN LEE ,  MING-HSUEH LEE

Inventor： KUO-CHI LIU ,  NAN-MING CHEN ,  YONG-CHIN LEE ,  MING-HSUEH LEE

IPC: H02M3/24

CPC classification number: H02M3/335 ,  H02M3/156 ,  H02M2001/007

Abstract: A power supply includes an isolated power converter and a DC/DC converter. The isolated power converter includes a primary winding connected to a primary power stage, a secondary winding to generate a first output voltage, and an auxiliary winding at the primary side to generate a voltage signal proportional to the first output voltage to stabilize the first output voltage. The DC/DC converter converts the first output voltage into a second output voltage for supplying for a load.

Abstract translation: 电源包括隔离电源转换器和DC / DC转换器。 隔离式功率转换器包括连接到主功率级的初级绕组，产生第一输出电压的次级绕组和初级侧的辅助绕组，以产生与第一输出电压成比例的电压信号，以稳定第一输出电压 。 DC / DC转换器将第一输出电压转换成用于为负载提供的第二输出电压。

公开(公告)号：US20100051324A1

公开(公告)日：2010-03-04

申请号：US11917445

申请日：2006-06-20

Applicant: Vincent Yong Chin Lee ,  Yi Liang Fu ,  Tatsunori Koyanagi ,  Yoshiyuki Ohkura ,  Masahiko Ito

Inventor： Vincent Yong Chin Lee ,  Yi Liang Fu ,  Tatsunori Koyanagi ,  Yoshiyuki Ohkura ,  Masahiko Ito

IPC: H05K1/02 ,  G03F7/20

CPC classification number: H05K3/002 ,  H05K1/028 ,  H05K2201/0166 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2203/1184

Abstract: An aspect of the present invention comprises a method of forming holes in a dielectric substrate comprising the steps of applying a layer of photoresist to a dielectric substrate, exposing portions of the photoresist to actinic radiation through a photomask to form a pattern in the photoresist for an array of holes to be etched in the substrate, developing the photoresist, etching the dielectric substrate to form an array of holes, each hole extending at least partially through the dielectric substrate, and removing the excess photoresist. Another aspect of the present invention is a method of simultaneously forming holes in a dielectric substrate some of which extend partially through the substrate and some of which extend completely through the substrate. Other aspects of the present invention are dielectric substrates formed using the methods of the invention.

Abstract translation: 本发明的一个方面包括一种在电介质衬底中形成孔的方法，包括以下步骤：将光致抗蚀剂层施加到电介质衬底上，将光致抗蚀剂的部分暴露于通过光掩模的光化辐射，以在光致抗蚀剂中形成图案， 在衬底中蚀刻的孔的阵列，显影光致抗蚀剂，蚀刻电介质衬底以形成孔阵列，每个孔至少部分延伸穿过电介质衬底，以及去除多余的光致抗蚀剂。 本发明的另一方面是在电介质基板中同时形成空穴的方法，其中一些部分延伸穿过基底，其中一些完全延伸穿过基底。 本发明的其它方面是使用本发明的方法形成的电介质基片。