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公开(公告)号：US20120002399A1
公开(公告)日：2012-01-05
申请号：US13163941
申请日：2011-06-20
申请人： Ching-Kun Lai , Ya-Chun Tu
发明人： Ching-Kun Lai , Ya-Chun Tu
CPC分类号： G09F13/0413 , F21V19/008 , G02F1/133608 , G09F2013/0418 , G09F2013/1854
摘要： A film support includes a pillar and a supporting unit. The pillar has an outer wall which encloses an accommodation space. The supporting unit has a supporting end and an assembly portion connected to each other, wherein the assembly portion is disposed in the accommodation space whereas the supporting end protrudes outside the pillar. The assembly portion of the supporting unit has a degree of freedom of rotation within the accommodation space and when the assembly portion rotates with respect to the pillar, the supporting end is driven to rotate with respect to the pillar.
摘要翻译： 胶片支架包括支柱和支撑单元。 支柱具有包围容纳空间的外壁。 支撑单元具有支撑端和彼此连接的组装部分，其中组装部分设置在容纳空间中，而支撑端突出到柱的外部。 支撑单元的组装部分在容纳空间内具有旋转自由度，并且当组装部分相对于柱体旋转时，支撑端被驱动以相对于柱体旋转。
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公开(公告)号：US08235551B2
公开(公告)日：2012-08-07
申请号：US12634468
申请日：2009-12-09
申请人： Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
发明人： Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
CPC分类号： F21V19/02 , F21K9/00 , F21Y2107/50 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2924/01047 , H01L2924/01322 , H01L2924/00014 , H01L2924/00 , H01L2924/01014
摘要： A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.
摘要翻译： 一种发光二极管（LED）模块和一种LED封装方法。 由于LED模块在考虑到烛光分布的情况下被封装，所以封装在LED模块中的LED芯片的每个引线框架被弯曲以使LED芯片以不同的角度倾斜以呈现各种照明效果。 同时，在LED封装方法中，可以通过一次操作快速地将多个LED芯片加载在一起，从而导致烛光分布曲线的偏差较小。
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公开(公告)号：US20100157595A1
公开(公告)日：2010-06-24
申请号：US12634468
申请日：2009-12-09
申请人： Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
发明人： Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
CPC分类号： F21V19/02 , F21K9/00 , F21Y2107/50 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2924/01047 , H01L2924/01322 , H01L2924/00014 , H01L2924/00 , H01L2924/01014
摘要： A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.
摘要翻译： 一种发光二极管（LED）模块和一种LED封装方法。 由于LED模块在考虑到烛光分布的情况下被封装，所以封装在LED模块中的LED芯片的每个引线框架被弯曲以使LED芯片以不同的角度倾斜以呈现各种照明效果。 同时，在LED封装方法中，可以通过一次操作快速地将多个LED芯片加载在一起，从而导致烛光分布曲线的偏差较小。
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公开(公告)号：US20140183016A1
公开(公告)日：2014-07-03
申请号：US13944901
申请日：2013-07-18
申请人： Ya-Chun Tu
发明人： Ya-Chun Tu
IPC分类号： H01H13/02
CPC分类号： H01H13/83 , H01H3/125 , H01H2219/036 , H01H2219/04 , H01H2219/056 , H01H2221/07
摘要： A lighting module is adapted to an electronic device. The electronic device includes a light transmitting portion. The lighting module comprises a light source and a microstructure. The light source is disposed in the electronic device, and the light source includes a light emitting surface facing the light transmitting portion. The microstructure is disposed between the light emitting surface of the light source and the light transmitting portion.
摘要翻译： 照明模块适用于电子设备。 电子设备包括光传输部分。 照明模块包括光源和微结构。 光源设置在电子设备中，并且光源包括面向光透射部分的光发射表面。 微结构设置在光源的光发射表面和光透射部分之间。
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公开(公告)号：US20140166460A1
公开(公告)日：2014-06-19
申请号：US13913496
申请日：2013-06-09
申请人： Ya-Chun Tu
发明人： Ya-Chun Tu
IPC分类号： H01H13/14
CPC分类号： H01H13/7073 , H01H13/7065 , H01H2221/05 , H01H2221/084 , H01H2227/016 , H01H2229/048 , H01H2235/018
摘要： A key structure comprises a bottom portion, a keycap and an elastic element. The bottom portion includes a pressing portion. The keycap includes a conducting portion and a fixing portion. The elastic element is a hollow structure formed by linear winding, and it is disposed between the bottom portion and the keycap. The conducting portion passes through the hollow structure and corresponds to the pressing portion, and the fixing portion is used to fix the elastic element. The keycap is movably fixed to the bottom portion, and the conducting portion is connected to the pressing portion when the keycap moves towards the bottom portion.
摘要翻译： 钥匙结构包括底部，键帽和弹性元件。 底部包括按压部。 键帽包括导电部分和固定部分。 弹性元件是通过线性缠绕形成的中空结构，并且其设置在底部和键帽之间。 导电部分穿过中空结构并对应于按压部分，并且固定部分用于固定弹性元件。 键帽可移动地固定到底部，并且当键帽朝向底部移动时，导电部分连接到按压部分。
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公开(公告)号：US08585229B2
公开(公告)日：2013-11-19
申请号：US13163941
申请日：2011-06-20
申请人： Ching-Kun Lai , Ya-Chun Tu
发明人： Ching-Kun Lai , Ya-Chun Tu
CPC分类号： G09F13/0413 , F21V19/008 , G02F1/133608 , G09F2013/0418 , G09F2013/1854
摘要： A film support includes a pillar and a supporting unit. The pillar has an outer wall which encloses an accommodation space. The supporting unit has a supporting end and an assembly portion connected to each other, wherein the assembly portion is disposed in the accommodation space whereas the supporting end protrudes outside the pillar. The assembly portion of the supporting unit has a degree of freedom of rotation within the accommodation space and when the assembly portion rotates with respect to the pillar, the supporting end is driven to rotate with respect to the pillar.
摘要翻译： 胶片支架包括支柱和支撑单元。 支柱具有包围容纳空间的外壁。 支撑单元具有支撑端和彼此连接的组装部分，其中组装部分设置在容纳空间中，而支撑端突出到柱的外部。 支撑单元的组装部分在容纳空间内具有旋转自由度，并且当组装部分相对于柱体旋转时，支撑端被驱动以相对于柱体旋转。
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公开(公告)号：US20130005055A1
公开(公告)日：2013-01-03
申请号：US13543418
申请日：2012-07-06
申请人： Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
发明人： Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
IPC分类号： H01L33/62
CPC分类号： F21V19/02 , F21K9/00 , F21Y2107/50 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2924/01047 , H01L2924/01322 , H01L2924/00014 , H01L2924/00 , H01L2924/01014
摘要： A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.
摘要翻译： 一种发光二极管（LED）模块和一种LED封装方法。 由于LED模块在考虑到烛光分布的情况下被封装，所以封装在LED模块中的LED芯片的每个引线框架被弯曲以使LED芯片以不同的角度倾斜以呈现各种照明效果。 同时，在LED封装方法中，可以通过一次操作快速地将多个LED芯片加载在一起，从而导致烛光分布曲线的偏差较小。
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公开(公告)号：US20140216906A1
公开(公告)日：2014-08-07
申请号：US14141476
申请日：2013-12-27
申请人： Wen-Yuan Lin , Ya-Chun Tu
发明人： Wen-Yuan Lin , Ya-Chun Tu
IPC分类号： H01H3/12
CPC分类号： H01H3/122 , H01H2217/004 , H01H2219/036 , H01H2221/026 , H01H2221/058
摘要： A key structure including a bottom portion, a keycap, an elastic element and a positioning unit is provided. The keycap includes a plurality of fixing portions. The elastic element is configured between the bottom portion and the keycap. The positioning unit is fixed on the bottom portion and is assembled with the fixing portions. The keycap moves relative to the bottom portion via the positioning unit.
摘要翻译： 提供了包括底部，键帽，弹性元件和定位单元的键结构。 键帽包括多个固定部。 弹性元件构造在底部和键帽之间。 定位单元固定在底部并与固定部组装。 键帽通过定位单元相对于底部部分移动。
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