公开(公告)号：US20120161322A1

公开(公告)日：2012-06-28

申请号：US13163989

申请日：2011-06-20

申请人： Shunichi Wakayanagi ,  Takayuki Saito ,  Takuya Seino ,  Akira Matsuo ,  Koji Yamazaki ,  Eitaro Morimoto ,  Yohsuke Shibuya ,  Yu Sato ,  Naomu Kitano

发明人： Shunichi Wakayanagi ,  Takayuki Saito ,  Takuya Seino ,  Akira Matsuo ,  Koji Yamazaki ,  Eitaro Morimoto ,  Yohsuke Shibuya ,  Yu Sato ,  Naomu Kitano

IPC分类号： H01L29/45 ,  H01L21/285 ,  C23C16/50

CPC分类号： H01L21/76843 ,  C23C14/0641 ,  H01L21/2855 ,  H01L21/76877 ,  H01L23/53223 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides an electronic component manufacturing method including a step of embedding a metal film. An embodiment of the present invention includes a first step of depositing a barrier layer containing titanium nitride on an object to be processed on which a concave part is formed and a second step of filling a low-melting-point metal directly on the barrier layer under a temperature condition allowing the low-melting-point metal to flow, by a PCM sputtering method while forming a magnetic field by a magnet unit including plural magnets which are arranged at grid points of a polygonal grid so as to have different polarities between the neighboring magnets.

摘要翻译： 本发明提供了一种电子部件制造方法，其包括嵌入金属膜的步骤。 本发明的一个实施方案包括在其上形成有凹部的待处理物体上沉积包含氮化钛的阻挡层的第一步骤和将低熔点金属直接填充在阻挡层下面的第二步骤 通过PCM溅射法，通过包括多个磁铁的磁体单元形成磁场，允许低熔点金属流动的温度条件，该多个磁体布置在多边形网格的网格点处，以便在相邻的 磁铁。

公开(公告)号：US08835296B2

公开(公告)日：2014-09-16

申请号：US13163989

申请日：2011-06-20

申请人： Shunichi Wakayanagi ,  Takayuki Saito ,  Takuya Seino ,  Akira Matsuo ,  Koji Yamazaki ,  Eitaro Morimoto ,  Yohsuke Shibuya ,  Yu Sato ,  Naomu Kitano

发明人： Shunichi Wakayanagi ,  Takayuki Saito ,  Takuya Seino ,  Akira Matsuo ,  Koji Yamazaki ,  Eitaro Morimoto ,  Yohsuke Shibuya ,  Yu Sato ,  Naomu Kitano

IPC分类号： H01L29/45 ,  H01L21/285

CPC分类号： H01L21/76843 ,  C23C14/0641 ,  H01L21/2855 ,  H01L21/76877 ,  H01L23/53223 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides an electronic component manufacturing method including a step of embedding a metal film. An embodiment of the present invention includes a first step of depositing a barrier layer containing titanium nitride on an object to be processed on which a concave part is formed and a second step of filling a low-melting-point metal directly on the barrier layer under a temperature condition allowing the low-melting-point metal to flow, by a PCM sputtering method while forming a magnetic field by a magnet unit including plural magnets which are arranged at grid points of a polygonal grid so as to have different polarities between the neighboring magnets.

摘要翻译： 本发明提供了一种电子部件制造方法，其包括嵌入金属膜的步骤。 本发明的一个实施方案包括在其上形成有凹部的待处理物体上沉积包含氮化钛的阻挡层的第一步骤和将低熔点金属直接填充在阻挡层下面的第二步骤 通过PCM溅射法，通过包括多个磁铁的磁体单元形成磁场，允许低熔点金属流动的温度条件，该多个磁体布置在多边形网格的网格点处，以便在相邻的 磁铁。

公开(公告)号：US08252118B2

公开(公告)日：2012-08-28

申请号：US12423235

申请日：2009-04-14

申请人： Yohsuke Shibuya ,  Yasuyuki Shirai ,  Hirofumi Asanuma ,  Junji Nakamura

发明人： Yohsuke Shibuya ,  Yasuyuki Shirai ,  Hirofumi Asanuma ,  Junji Nakamura

IPC分类号： H01L21/306 ,  C23C16/44

CPC分类号： C23C14/50 ,  C23C14/541 ,  H01L21/67103 ,  H01L21/67109 ,  Y10T279/23

摘要： There is provided a substrate support device capable of preventing powder dust from being produced. A thermoconductive intermediate member is interposed between a base table and a substrate support table and has a communication aperture path for communicating the aperture path of the base table with the aperture path of the substrate support table. An elastic member such as bellows tube is disposed in the communication aperture path of the thermoconductive intermediate member, for insulating the thermoconductive intermediate member from the inert gas which flows through the communication aperture path.

摘要翻译： 提供了能够防止粉尘产生的基板支撑装置。 导热中间构件插入在基台和基板支撑台之间，并且具有用于使基台的孔径路径与基板支撑台的孔径连通的连通孔径路径。 诸如波纹管的弹性构件设置在导热中间构件的连通孔径路径中，用于使导热中间构件与流过连通孔径的惰性气体绝缘。

公开(公告)号：US20090308537A1

公开(公告)日：2009-12-17

申请号：US12423235

申请日：2009-04-14

申请人： Yohsuke Shibuya ,  Yasuyuki Shirai ,  Hirofumi Asanuma ,  Junji Nakamura

发明人： Yohsuke Shibuya ,  Yasuyuki Shirai ,  Hirofumi Asanuma ,  Junji Nakamura

IPC分类号： H01L21/306 ,  C23C16/44 ,  C23C14/34 ,  C23C16/513

CPC分类号： C23C14/50 ,  C23C14/541 ,  H01L21/67103 ,  H01L21/67109 ,  Y10T279/23

摘要： There is provided a substrate support device capable of preventing powder dust from being produced. A thermoconductive intermediate member is interposed between a base table and a substrate support table and has a communication aperture path for communicating the aperture path of the base table with the aperture path of the substrate support table. An elastic member such as bellows tube is disposed in the communication aperture path of the thermoconductive intermediate member, for insulating the thermoconductive intermediate member from the inert gas which flows through the communication aperture path.

摘要翻译： 提供了能够防止粉尘产生的基板支撑装置。 导热中间构件插入在基台和基板支撑台之间，并且具有用于使基台的孔径路径与基板支撑台的孔径连通的连通孔径路径。 诸如波纹管的弹性构件设置在导热中间构件的连通孔径路径中，用于使导热中间构件与流过连通孔径的惰性气体绝缘。

公开(公告)号：US20090283976A1

公开(公告)日：2009-11-19

申请号：US12432098

申请日：2009-04-29

申请人： Kazuaki Kaneko ,  Yoh Tanaka ,  Masayoshi Ikeda ,  Yohsuke Shibuya

发明人： Kazuaki Kaneko ,  Yoh Tanaka ,  Masayoshi Ikeda ,  Yohsuke Shibuya

IPC分类号： B23Q3/15 ,  B23Q3/00

CPC分类号： H01L21/6831 ,  H01L21/67103 ,  H01L21/68728 ,  Y10T279/23 ,  Y10T279/34

摘要： A substrate holding apparatus comprises a substrate holding mechanism configured to hold a substrate; a heating mechanism; and a heat-conductive member which is interposed between the substrate holding mechanism and the heating mechanism to be in contact therewith and conducts heat generated by the heating mechanism to the substrate holding mechanism, wherein the heat-conductive member has a recessed section that opens to the substrate.

摘要翻译： 基板保持装置包括：基板保持机构，其构造成保持基板; 加热机构; 以及介于所述基板保持机构和所述加热机构之间以与其接触的导热构件，其将由所述加热机构产生的热量传导到所述基板保持机构，其中，所述导热构件具有： 底物。

公开(公告)号：US20120073960A1

公开(公告)日：2012-03-29

申请号：US13223830

申请日：2011-09-01

申请人： Yohsuke SHIBUYA ,  Masayoshi Ikeda ,  Yasumi Sago

发明人： Yohsuke SHIBUYA ,  Masayoshi Ikeda ,  Yasumi Sago

IPC分类号： C23C14/35

CPC分类号： H01L21/67005 ,  C23C14/35 ,  H01J37/3408 ,  H01J37/3452 ,  H01L21/28061 ,  H01L21/2855 ,  H01L29/4941 ,  H01L29/78

摘要： A magnetron sputtering apparatus includes a cathode electrode having a first surface and a second surface opposite to the first surface, a target attachable to the first surface of the cathode electrode, and a magnet unit which is adjacent to the second surface of the cathode electrode and forms a magnetic field on the target surface. The magnet unit includes a plurality of magnet pieces each having a first magnet member which is magnetized in a direction perpendicular to the target and is arranged with a magnetic pole end face oriented toward the target, and a second magnet member which is magnetized opposite to the first magnet member in the direction perpendicular to the target and is arranged in contact with the first magnet member with a magnetic pole end face being oriented toward the target.

摘要翻译： 磁控管溅射装置包括具有第一表面和与第一表面相对的第二表面的阴极，可附着到阴极电极的第一表面的靶和与阴极的第二表面相邻的磁体单元， 在目标表面上形成磁场。 磁体单元包括多个磁体片，每个磁体片具有在垂直于靶的方向上被磁化的第一磁体部件，并且配置有朝向靶子的磁极端面，并且与第二磁体部件相对地被磁化 第一磁体构件沿垂直于靶的方向设置成与第一磁体构件接触，磁极端面朝向靶。