摘要:
In a method of forming a wire structure, first active regions and second active regions are formed on a substrate. Each of the first active regions has a first sidewall of a positive slope and a second sidewall opposed to the first sidewall. The second active regions are arranged along a first direction. An isolation layer is between the first active regions and the second active regions. A first mask is formed on the first active regions, the second active regions and the isolation layer. The first mask has an opening exposing the first sidewall and extending along the first direction. The first active regions, the second active regions and the isolation layer are etched using the first mask to form a groove extending along the first direction and to form a fence having a height substantially higher than a bottom face of the groove. A wire is formed to fill the groove. A contact is formed on the wire. The contact is disposed toward the second active regions from the fence.
摘要:
The present invention provides a mmode imaging method and apparatus for an ultrasonic diagnosis device to increase the continuity of the displayed mmode images. The mmode imaging method of the invention comprises steps: define a sample line on a frame of bmode image, so as to select bmode data of sample points constituting the sample line; convert the bmode data of the sample points obtained from two consecutive frames of bmode image into two of mmode lines arranged in time order in a mmode image; at predetermined positions between the two mmode lines, generate mmode data that constitute at least one mmode lines based on the echo data of corresponding sample points on the two mmode lines; and image the mmode data in time sequence.
摘要:
A backlight assembly includes a lamp socket unit, a printed circuit board and a lower receiving container. The printed circuit board includes a cutout portion which receives the lamp socket unit therethrough. The lower receiving container receives the lamp socket unit and the printed circuit board. The lamp socket unit is coupled to the printed circuit board, and the printed circuit board, having the lamp socket unit coupled thereto, is disposed in the lower receiving container.