摘要:
A backlight assembly includes a lamp socket unit, a printed circuit board and a lower receiving container. The printed circuit board includes a cutout portion which receives the lamp socket unit therethrough. The lower receiving container receives the lamp socket unit and the printed circuit board. The lamp socket unit is coupled to the printed circuit board, and the printed circuit board, having the lamp socket unit coupled thereto, is disposed in the lower receiving container.
摘要:
A backlight assembly includes a lamp socket unit, a printed circuit board and a lower receiving container. The printed circuit board includes a cutout portion which receives the lamp socket unit therethrough. The lower receiving container receives the lamp socket unit and the printed circuit board. The lamp socket unit is coupled to the printed circuit board, and the printed circuit board, having the lamp socket unit coupled thereto, is disposed in the lower receiving container.
摘要:
Provided is a liquid crystal display device which is capable of preventing light leakage and preventing a dark portion from being viewed. The liquid crystal display device includes: a lower receiving container; a plurality of supporting walls arranged in a line along at least one side wall of the lower receiving container with gaps therebetween; a plurality of light sources arranged in a line so as to be provided in the gaps; and a reflecting cover covering at least a portion of each of the gaps.
摘要:
A display device has light sources located in a receptacle, where a lower interior walls part of the receptacle is formed of an electrically insulating material. The device includes a vertically extending grounding electrode extending to and physically affixed at one end to the interior walls part of the receptacle. This allows the light sources to be easily grounded by means of the grounding electrode.
摘要:
Some embodiments include a display device having light sources located in a receptacle formed of an insulating material. The light sources can be easily grounded. The display device comprises a display panel for displaying an image; one or more light sources for providing light to the display panel; a lower receptacle formed of an insulating material and including a bottom part and side-wall parts surrounding the bottom part; an upper receptacle coupled to the lower receptacle, the upper and lower receptacles containing therebetween the display panel and the light sources; and a ground electrode physically contacting the upper and lower receptacles and electrically connected to each said light source. Other features are also provided.
摘要:
Provided is a liquid crystal display device which is capable of preventing light leakage and preventing a dark portion from being viewed. The liquid crystal display device includes: a lower receiving container; a plurality of supporting walls arranged in a line along at least one side wall of the lower receiving container with gaps therebetween; a plurality of light sources arranged in a line so as to be provided in the gaps; and a reflecting cover covering at least a portion of each of the gaps.
摘要:
A method of fabricating an integrated circuit device includes forming first and second mask structures on respective first and second regions of a feature layer. Each of the first and second mask structures includes a dual mask pattern and an etch mask pattern thereon having an etch selectivity relative to the dual mask pattern. The etch mask patterns of the first and second mask structures are etched to partially remove the etch mask pattern from the second mask structure. Spacers are formed on opposing sidewalls of the first and second mask structures. The first mask structure is selectively removed from between the spacers in the first region to define a first mask pattern including the opposing sidewall spacers with a void therebetween in the first region, and a second mask pattern including the opposing sidewall spacers with the second mask structure therebetween in the second region.
摘要:
Provided is a method of forming patterns for a semiconductor device in which fine patterns and large-width patterns are formed simultaneously and adjacent to each other. In the method, a first layer is formed on a substrate so as to cover a first region and a second region which are included in the substrate. Both a blocking pattern covering a portion of the first layer in the first region and a low-density large-width pattern covering a portion of the first layer in the second region are simultaneously formed. A plurality of sacrificial mask patterns are formed on the first layer and the blocking pattern in the first region. A plurality of spacers covering exposed sidewalls of the plurality of sacrificial mask patterns are formed. The plurality of sacrificial mask patterns are removed. The first layer in the first and second regions are simultaneously etched by using the plurality of spacers and the blocking pattern as etch masks in the first region and using the low-density large-width pattern as an etch mask in the second region.
摘要:
Provided is a method of forming patterns for a semiconductor device in which fine patterns and large-width patterns are formed simultaneously and adjacent to each other. In the method, a first layer is formed on a substrate so as to cover a first region and a second region which are included in the substrate. Both a blocking pattern covering a portion of the first layer in the first region and a low-density large-width pattern covering a portion of the first layer in the second region are simultaneously formed. A plurality of sacrificial mask patterns are formed on the first layer and the blocking pattern in the first region. A plurality of spacers covering exposed sidewalls of the plurality of sacrificial mask patterns are formed. The plurality of sacrificial mask patterns are removed. The first layer in the first and second regions are simultaneously etched by using the plurality of spacers and the blocking pattern as etch masks in the first region and using the low-density large-width pattern as an etch mask in the second region.
摘要:
In a method of forming a semiconductor device, a feature layer is provided on a substrate and a mask layer is provided on the feature layer. A portion of the mask layer is removed in a first region of the semiconductor device where fine features of the feature layer are to be located, the mask layer remaining in a second region of the semiconductor device where broad features of the feature layer are to be located. A mold mask pattern is provided on the feature layer in the first region and on the mask layer in the second region. A spacer layer is provided on the mold mask pattern in the first region and in the second region. An etching process is performed to etch the spacer layer so that spacers remain at sidewalls of pattern features of the mold mask pattern, and to etch the mask layer in the second region to provide mask layer patterns in the second region. The feature layer is etched using the mask layer patterns as an etch mask in the second region and using the spacers as an etch mask in the first region to provide a feature layer pattern having fine features in the first region and broad features in the second region.