公开(公告)号：US20120080224A1

公开(公告)日：2012-04-05

申请号：US13137871

申请日：2011-09-20

申请人： Je Gwang Yoo ,  Bong Kyu Choi ,  Yong Soo An

发明人： Je Gwang Yoo ,  Bong Kyu Choi ,  Yong Soo An

IPC分类号： H05K9/00 ,  H05K3/02 ,  H05K3/46

CPC分类号： H05K1/0221 ,  H05K3/28 ,  H05K2201/0195 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.

摘要翻译： 提供了一种用于信号传输的电路板及其制造方法。 用于信号传输的电路板包括第一绝缘层，布置在第一绝缘层上的多个信号互连，布置在多个信号互连两侧的第一绝缘层上的接地互连，设置在第一绝缘层上的第一绝缘层 包括多个信号互连和接地互连的绝缘层，设置在第二绝缘层上的第一屏蔽层，用于电连接接地互连和第一屏蔽层并穿过第二绝缘层的第一屏蔽层，第二屏蔽层 设置在第一绝缘层下面的第二屏蔽壁和用于电连接接地互连和第二屏蔽层并穿过第一绝缘层的第二屏蔽壁。