公开(公告)号：US20100121465A1

公开(公告)日：2010-05-13

申请号：US12596860

申请日：2008-04-02

申请人： Toshihiro Kanbara ,  Yoshihiko Murakami ,  Takanori Ogura ,  Fumitaka Kimura

发明人： Toshihiro Kanbara ,  Yoshihiko Murakami ,  Takanori Ogura ,  Fumitaka Kimura

IPC分类号： G05B19/418 ,  G05D23/19

CPC分类号： G05B23/0213 ,  G05B23/0297 ,  G05B2219/31433 ,  G06Q10/06

摘要： A group management apparatus is connected to first to nth management apparatus that collectively manage a plurality of installation equipment belonging to first to nth installation equipment groups, and collectively manages the first to nth installation equipment groups. One or more interrogation processors repeatedly carry out interrogation processing for the first to nth management apparatus regarding operating conditions of the installation equipment collectively managed by the first to nth management apparatus. Preferably, an allocation unit allocates different interrogation processors to the first to nth management apparatus, respectively, one at a time, and allocates other allocation processors to the first to nth management apparatus according to an interrogation processing state of the installation equipment by at least one of the interrogation processors.

摘要翻译： 组管理装置连接到共同管理属于第一至第n安装设备组的多个安装设备的第一至第n管理装置，并且共同管理第一至第n安装设备组。 一个或多个询问处理器对与第一至第n管理装置共同管理的安装设备的操作条件相反地对第一至第n管理装置执行询问处理。 优选地，分配单元分别向第一至第n管理装置分配不同的询问处理器，一次一个地分配询问处理器，并且根据安装设备的询问处理状态，至少一个分配给第一至第n管理装置的其他分配处理器 的询问处理器。

公开(公告)号：US07097395B2

公开(公告)日：2006-08-29

申请号：US10901166

申请日：2004-07-29

申请人： Osamu Horiuchi ,  Yoshihiko Murakami

发明人： Osamu Horiuchi ,  Yoshihiko Murakami

IPC分类号： B23B51/08

CPC分类号： B23G5/062 ,  B23B51/08 ,  B23G5/20 ,  B23G2200/143 ,  B23G2200/24 ,  B23G2240/08 ,  Y10T408/03 ,  Y10T408/348 ,  Y10T408/356 ,  Y10T408/62 ,  Y10T408/9048 ,  Y10T409/4028

摘要： Since the chip-breaking groove 30 is cut in the inner peripheral surface of the prepared hole 22 by compressing the chip-breaking tool 10 into the prepared hole 22 prior to the tapping process (the cutting process of the female thread) by the cut tap, the chip can be securely broken by the chip-breaking groove 30 and well discharged even in the case that the work 20 is made of the material having the high ductility. Accordingly, for example, as shown in FIG. 10, it is possible to prevent a lot of long connected chips from entwining the tap, it is unnecessary to monitor the tapping work, and it is possible to achieve a complete automation (an unmanned work). Further, it is possible to inhibit the cut tap from being broken due to the pinching of the chip, and it is easy to execute a treatment such as a chip cleaning or the like.

摘要翻译： 由于通过在切割过程（内螺纹的切割过程）之前通过切割丝锥将切屑破坏工具10压缩到预备孔22中，从而在预备孔22的内周面上切割切屑槽30 即使在工件20由具有高延展性的材料制成的情况下，也可以通过切屑槽30牢固地断开切屑，并且即使在切屑槽30中也能够良好地排出切屑。 因此，例如，如图1所示。 如图10所示，可以防止大量长连接的芯片与水龙头缠结，不需要监视攻丝工作，并且可以实现完全的自动化（无人工作）。 此外，可以抑制由于芯片的夹持而导致的切断丝锥破损，并且容易进行诸如芯片清洁等的处理。

公开(公告)号：US20050053437A1

公开(公告)日：2005-03-10

申请号：US10901166

申请日：2004-07-29

申请人： Osamu Horiuchi ,  Yoshihiko Murakami

发明人： Osamu Horiuchi ,  Yoshihiko Murakami

IPC分类号： B23B51/08 ,  B23G5/06 ,  B23G5/20

CPC分类号： B23G5/062 ,  B23B51/08 ,  B23G5/20 ,  B23G2200/143 ,  B23G2200/24 ,  B23G2240/08 ,  Y10T408/03 ,  Y10T408/348 ,  Y10T408/356 ,  Y10T408/62 ,  Y10T408/9048 ,  Y10T409/4028

摘要： Since the chip-breaking groove 30 is cut in the inner peripheral surface of the prepared hole 22 by compressing the chip-breaking tool 10 into the prepared hole 22 prior to the tapping process (the cutting process of the female thread) by the cut tap, the chip can be securely broken by the chip-breaking groove 30 and well discharged even in the case that the work 20 is made of the material having the high ductility. Accordingly, for example, as shown in FIG. 10, it is possible to prevent a lot of long connected chips from entwining the tap, it is unnecessary to monitor the tapping work, and it is possible to achieve a complete automation (an unmanned work). Further, it is possible to inhibit the cut tap from being broken due to the pinching of the chip, and it is easy to execute a treatment such as a chip cleaning or the like.

摘要翻译： 由于通过在切割过程（内螺纹的切割过程）之前通过切割丝锥将切屑破坏工具10压缩到预备孔22中，从而在预备孔22的内周面上切割切屑槽30 即使在工件20由具有高延展性的材料制成的情况下，也可以通过切屑槽30牢固地断开切屑，并且即使在切屑槽30中也能够良好地排出切屑。 因此，例如，如图1所示。 如图10所示，可以防止大量长连接的芯片与水龙头缠结，不需要监视攻丝工作，并且可以实现完全的自动化（无人工作）。 此外，可以抑制由于芯片的夹持而导致的切断丝锥破损，并且容易进行诸如芯片清洁等的处理。

公开(公告)号：US06656591B2

公开(公告)日：2003-12-02

申请号：US09960375

申请日：2001-09-24

申请人： Hao Liu ,  Yoshihiko Murakami ,  Hiroyuki Hanyu

发明人： Hao Liu ,  Yoshihiko Murakami ,  Hiroyuki Hanyu

IPC分类号： B32J900

CPC分类号： C23C16/0272 ,  B23C5/10 ,  B23C2224/14 ,  B23C2224/24 ,  B23C2224/56 ,  B23C2226/31 ,  B23C2228/10 ,  C23C16/27 ,  Y10T428/24479 ,  Y10T428/24628 ,  Y10T428/252 ,  Y10T428/265 ,  Y10T428/30

摘要： A diamond-coated body including: a substrate formed of a cemented carbide; a diamond coating; and an interface layer interposed between the substrate and the diamond coating, wherein the interface layer consists of a solid solution including an aluminum nitride and a metal which belongs to one of groups IVa, Va and VIa of the periodic table. The interface layer is preferably provided by one of TiAlN, CrAlN and VAlN. The substrate is preferably formed of a super-fine particle cemented carbide.

公开(公告)号：US20100064037A1

公开(公告)日：2010-03-11

申请号：US12593635

申请日：2008-04-04

申请人： Yoshihiko Murakami ,  Toshihiro Kanbara ,  Naotake Shimozu

发明人： Yoshihiko Murakami ,  Toshihiro Kanbara ,  Naotake Shimozu

IPC分类号： G06F15/173

CPC分类号： G06Q10/06

摘要： A first management apparatus that is connected to a first equipment device group including a plurality of first equipment devices centrally manages the first equipment devices. A second management apparatus connected to a second equipment device group including a plurality of second equipment devices separate from the plurality of first equipment devices centrally manages the second equipment devices. A group management apparatus connected to the first and second management apparatus centrally manages the first and second equipment device groups. The first and second management apparatus include first and second management programs to centrally manage the first and second equipment devices. The group management apparatus includes a group management program for centrally managing the first and second equipment device groups.

摘要翻译： 连接到包括多个第一设备设备的第一设备设备组的第一管理设备集中管理第一设备设备。 连接到包括与多个第一设备设备分离的多个第二设备设备的第二设备设备组的第二管理设备集中管理第二设备设备。 连接到第一和第二管理装置的组管理装置集中管理第一和第二设备装置组。 第一和第二管理装置包括用于集中管理第一和第二设备装置的第一和第二管理程序。 组管理装置包括用于集中管理第一和第二设备装置组的组管理程序。

公开(公告)号：US08001230B2

公开(公告)日：2011-08-16

申请号：US12593635

申请日：2008-04-04

申请人： Yoshihiko Murakami ,  Toshihiro Kanbara ,  Naotake Shimozu

发明人： Yoshihiko Murakami ,  Toshihiro Kanbara ,  Naotake Shimozu

IPC分类号： G06F15/16 ,  G06F15/173 ,  G06F15/177

CPC分类号： G06Q10/06

摘要： A first management apparatus that is connected to a first equipment device group including a plurality of first equipment devices centrally manages the first equipment devices. A second management apparatus connected to a second equipment device group including a plurality of second equipment devices separate from the plurality of first equipment devices centrally manages the second equipment devices. A group management apparatus connected to the first and second management apparatus centrally manages the first and second equipment device groups. The first and second management apparatus include first and second management programs to centrally manage the first and second equipment devices. The group management apparatus includes a group management program for centrally managing the first and second equipment device groups.

摘要翻译： 连接到包括多个第一设备设备的第一设备设备组的第一管理设备集中管理第一设备设备。 连接到包括与多个第一设备设备分离的多个第二设备设备的第二设备设备组的第二管理设备集中管理第二设备设备。 连接到第一和第二管理装置的组管理装置集中管理第一和第二设备装置组。 第一和第二管理装置包括用于集中管理第一和第二设备装置的第一和第二管理程序。 组管理装置包括用于集中管理第一和第二设备装置组的组管理程序。

公开(公告)号：US4492552A

公开(公告)日：1985-01-08

申请号：US373800

申请日：1982-04-30

申请人： Yoshihiko Murakami ,  Noboru Ohta

发明人： Yoshihiko Murakami ,  Noboru Ohta

IPC分类号： B28B1/29 ,  B28B23/04 ,  B28B7/02

CPC分类号： B28B1/29 ,  B28B23/04

摘要： A combination long lower mold and pretension bench for the formation of prestressed concrete materials is constructed by serially connecting plurality of unit lower molds of concrete, attaching prestressing steel wire tension benches one each to the foremost and rearmost unit lower molds, and fastening the unit lower molds and the tension benches collectively with steel wires. Prestressed concrete materials are obtained by stretching prestressing steel wires along the upper surface of the long lower mold, continuously pouring and placing stiff-consistency concrete on the long lower mold, causing a slide upper mold to run on the concrete thereby shaping the concrete in a required cross section, curing the shaped concrete strip, and cutting the cured concrete strip into pieces of a desired size.

摘要翻译： 用于形成预应力混凝土材料的组合式长下模和预张紧架通过串联连接多个混凝土单元下模构成，将预应力钢丝张力台一个连接到最前面和最后面的单元下模，并将单元下固定 模具和钢丝共同的张力台。 预应力混凝土材料通过沿着长下模的上表面拉伸预应力钢丝而连续浇注并将刚性混凝土浇注在长的下模上，从而使滑动上模在混凝土上运行，从而将混凝土成形为 所需的横截面，固化成形的混凝土条，并将固化的混凝土条切割成所需尺寸的碎片。

公开(公告)号：US2907235A

公开(公告)日：1959-10-06

申请号：US58032656

申请日：1956-04-24

申请人： YOSHIHIKO MURAKAMI

发明人： YOSHIHIKO MURAKAMI

IPC分类号： B21B13/14

CPC分类号： B21B13/14