公开(公告)号：US09696094B2

公开(公告)日：2017-07-04

申请号：US13425476

申请日：2012-03-21

申请人： Michimasa Aoki ,  Masumi Suzuki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kouno ,  Kenji Katsumata ,  Wataru Nishiyama

发明人： Michimasa Aoki ,  Masumi Suzuki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kouno ,  Kenji Katsumata ,  Wataru Nishiyama

IPC分类号： F28D1/047 ,  H05K7/20 ,  F28F9/02 ,  F28D21/00 ,  H01L23/473

CPC分类号： F28D1/0476 ,  F28D2021/0031 ,  F28F9/0214 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  H01L2924/00

摘要： A cooling unit includes a tank having an inlet port and a discharge port for refrigerant, first and second radiators connected to the tank, the first and second radiators each having a flow path, an inlet chamber defined in the tank for supplying the refrigerant flowing therein from the inlet port to the first radiator, a discharge chamber defined in the tank for discharging the refrigerant cooled in the second radiator to the discharge port, and a reservoir in which bubbles generated in the refrigerant are collected, the reservoir being provided between the inlet chamber and the discharge chamber in the tank.

公开(公告)号：US08422228B2

公开(公告)日：2013-04-16

申请号：US12620396

申请日：2009-11-17

申请人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda

发明人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda

IPC分类号： H05K7/20 ,  F28D21/00

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： A cooling jacket includes: a flow channel member through which a cooling medium flows, at least a part of which is in contact with an object to be cooled, and which includes a region having a channel cross-sectional area larger than that of any other region; and a projection portion which is provided at a downstream side of the region where the channel cross-sectional area is large.

摘要翻译： 一种冷却套管包括：流动通道构件，冷却介质通过该流动通道构件流动，其至少一部分与要冷却的物体接触，并且其包括通道横截面积大于任何其它区域的区域 地区; 以及设置在通道横截面积大的区域的下游侧的突出部。

公开(公告)号：US08289701B2

公开(公告)日：2012-10-16

申请号：US11878620

申请日：2007-07-25

申请人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masuo Ohnishi ,  Masahiko Hattori

发明人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masuo Ohnishi ,  Masahiko Hattori

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： F28F3/12 ,  F28D9/00 ,  F28D15/00 ,  F28F3/025 ,  F28F9/0246 ,  G06F1/203 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat receiver includes a casing defining a flow passage on a thermal conductive plate. The thermal conductive plate is received on an electronic component. The thermal conductive plate serves to transfer heat to coolant in the flow passage. At least two inflow nozzles extend into the casing to have discharge openings opposed to the upstream end of the flow passage. The coolant flows into the flow passage through the inflow nozzles. At least two streams of the coolant are thus generated in the flow passage. The streams widely expand or spread in the flow passage. The coolant flows through the flow passage without stagnating. The coolant can thus absorb the heat of the thermal conductive plate in an efficient manner. This results in an efficient heat absorption of the heat receiver.

摘要翻译： 热接收器包括限定导热板上的流动通道的壳体。 导热板被接收在电子部件上。 导热板用于将热量传递到流动通道中的冷却剂。 至少两个流入喷嘴延伸到壳体中以具有与流动通道的上游端相对的排放口。 冷却剂通过流入喷嘴流入流动通道。 因此，在流路中产生至少两股冷却剂流。 流体在流动通道中广泛扩张或扩散。 冷却剂流经流道而不停滞。 因此，冷却剂可以以有效的方式吸收导热板的热量。 这导致热接收器的有效吸热。

公开(公告)号：US20120055654A1

公开(公告)日：2012-03-08

申请号：US13137654

申请日：2011-08-31

申请人： Kenji Katsumata ,  Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kuono ,  Hiroshi Muto

发明人： Kenji Katsumata ,  Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kuono ,  Hiroshi Muto

IPC分类号： F28F13/00 ,  F28D1/00

CPC分类号： H01L23/467 ,  F28D1/047 ,  F28D1/0472 ,  F28D15/00 ,  F28D2021/0031 ,  F28F2210/02 ,  F28F2210/10 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A radiator includes a core unit, which includes a flow inlet which coolant enters, a flow outlet from which the coolant exits, a plurality of coolant pathways including at least an outer coolant pathway, an inner coolant pathway, a branching point, and a merging point, the outer coolant pathway being disposed to surround the inner coolant pathway, the coolant being divided at the branching point and merging at the merging point, and a connecting pathway to connect between the merging point of the outer coolant pathway and the branching point of the inner coolant pathway, wherein the flow inlet is in communication with a branching point of an outermost one of the plurality of coolant pathways, and the flow output is in communication with a merging point of an innermost one of the plurality of coolant pathways.

摘要翻译： 散热器包括芯单元，其包括冷却剂进入的流入口，冷却剂从其流出的流出口，多个冷却剂通路，至少包括外部冷却剂通道，内部冷却剂通道，分支点和合并 所述外部冷却剂通道被设置为围绕所述内部冷却剂通道，所述冷却剂在所述分支点处被分割并在所述汇合点处汇合，以及连接路径以连接所述外部冷却剂通道的汇合点和所述外部冷却剂通道的分支点 所述内部冷却剂通道，其中所述流入口与所述多个冷却剂通道中的最外部冷却剂通道的分支点连通，并且所述流动输出与所述多个冷却剂通道中的最内部冷却剂通道的汇合点连通。

公开(公告)号：US20110128706A1

公开(公告)日：2011-06-02

申请号：US13022235

申请日：2011-02-07

申请人： Yosuke Tsunoda ,  Masumi Suzuki ,  Michimasa Aoki

发明人： Yosuke Tsunoda ,  Masumi Suzuki ,  Michimasa Aoki

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  H04M1/0202 ,  H05K7/20445

摘要： An electronic apparatus 100 includes a heat-generating element 1, a heat-radiating plate 4 which is used in heat radiation of the heat-generating element, and a housing 10 which accommodates the heat-generating element and the heat-radiating plate. The heat-radiating plate is disposed between the heat-generating element and a first wall portion 10a of the housing, and a support stage 5 for forming an air layer is disposed between the heat-radiating plate and the first wall portion. Since the heat-insulating effect of the air layer prevents the heat diffused from the heat-radiating plate from being easily conducted to the first wall portion, the formation of a heat spot in the first wall portion can be avoided even when the heat-generating element which generates a large amount of heat is used.

摘要翻译： 电子设备100包括发热元件1，用于发热元件的散热的散热板4和容纳发热元件和散热板的壳体10。 散热板设置在发热元件和壳体的第一壁部分10a之间，并且在散热板和第一壁部之间设置用于形成空气层的支撑台5。 由于空气层的绝热效果防止从散热板扩散的热容易被引导到第一壁部，所以即使在发热时也能够避免在第一壁部形成热斑 使用产生大量热量的元件。

公开(公告)号：US20100142145A1

公开(公告)日：2010-06-10

申请号：US12620396

申请日：2009-11-17

申请人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda

发明人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda

IPC分类号： H05K7/20 ,  F28D21/00

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： A cooling jacket includes: a flow channel member through which a cooling medium flows, at least a part of which is in contact with an object to be cooled, and which includes a region having a channel cross-sectional area larger than that of any other region; and a projection portion which is provided at a downstream side of the region where the channel cross-sectional area is large.

摘要翻译： 一种冷却套管包括：流动通道构件，冷却介质通过该流动通道构件流动，其至少一部分与要冷却的物体接触，并且其包括通道横截面积大于任何其他区域的区域 地区; 以及设置在通道横截面积大的区域的下游侧的突出部。

公开(公告)号：US07652884B2

公开(公告)日：2010-01-26

申请号：US11878615

申请日：2007-07-25

申请人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masuo Ohnishi ,  Masahiko Hattori

发明人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masuo Ohnishi ,  Masahiko Hattori

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： A liquid cooling unit includes components such as first and second heat receivers, a heat exchanger, a tank and a pump in an electronic apparatus. The electronic apparatus includes a first enclosure and a second enclosure coupled to the second enclosure for relative movement. The liquid cooling unit is enclosed in the first enclosure. No component of the liquid cooling unit is enclosed in the second enclosure. The liquid cooling unit is thus incorporated in the first enclosure in a facilitated manner. This results in a reduced production cost. The liquid cooling unit can also be removed from the first enclosure in a facilitated manner.

摘要翻译： 液体冷却单元包括电子设备中的诸如第一和第二热接收器，热交换器，罐和泵的部件。 电子设备包括第一外壳和耦合到第二外壳的第二外壳，用于相对移动。 液体冷却单元封闭在第一个外壳中。 没有液体冷却单元的部件被封闭在第二个外壳中。 因此，液体冷却单元以便利的方式结合在第一外壳中。 这导致生产成本降低。 液体冷却单元也可以以便利的方式从第一外壳移除。

公开(公告)号：US20080024981A1

公开(公告)日：2008-01-31

申请号：US11878616

申请日：2007-07-25

申请人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masuo Ohnishi ,  Masahiko Hattori

发明人： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masuo Ohnishi ,  Masahiko Hattori

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic component generates heat in an electronic apparatus. The heat of the electronic component is transferred to a thermal conductive plate of a heat receiver in a liquid cooling unit. The heat is transferred to coolant from the thermal conductive plate. The temperature of the coolant rises. The heat exchanger absorbs heat of the coolant. The coolant gets cooled. The heat of the electronic component is also transferred to the printed wiring board. The heat spreads over the printed wiring board through a wiring pattern in the printed wiring board. Since the tank or/and pump is placed at a position outside the printed wiring board, the heat cannot be transferred to the tank or/and the pump. This results in prevention of rise in the temperature of the coolant in the tank or/and the pump. The efficiency of heat radiation can thus be enhanced.

摘要翻译： 电子部件在电子设备中产生热量。 电子元件的热量被传送到液体冷却单元中的热接收器的导热板。 热量从导热板传递到冷却剂。 冷却液的温度升高。 热交换器吸收冷却剂的热量。 冷却液冷却。 电子部件的热也传递到印刷电路板。 印刷电路板上的布线图案散布在印刷电路板上。 由于罐或/和泵被放置在印刷线路板外部的位置，因此不能将热量传递到罐或泵。 这导致防止罐或/和泵中的冷却剂的温度升高。 因此可以提高散热效率。

公开(公告)号：US20120234515A1

公开(公告)日：2012-09-20

申请号：US13408097

申请日：2012-02-29

申请人： Shinichirou KOUNO ,  Masumi SUZUKI ,  Masaru SUGIE ,  Michimasa AOKI ,  Kenji KATSUMATA ,  Yosuke TSUNODA ,  Wataru NISHIYAMA

发明人： Shinichirou KOUNO ,  Masumi SUZUKI ,  Masaru SUGIE ,  Michimasa AOKI ,  Kenji KATSUMATA ,  Yosuke TSUNODA ,  Wataru NISHIYAMA

IPC分类号： F28F9/00

CPC分类号： F28F13/00 ,  F28D2021/0028 ,  F28F3/12 ,  H01L23/36 ,  H01L23/38 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H01L2924/00

摘要： A cooling unit includes a cooling member cooled by a cooling body, a plurality of heat transfer members, and a support member. Each of the plurality of heat transfer members has a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with a target to be cooled. The support member supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member.

摘要翻译： 冷却单元包括由冷却体冷却的冷却构件，多个传热构件和支撑构件。 多个传热构件中的每一个具有第一接触部分和第二接触部分，第一接触部分构造成与冷却部件接触，第二接触部分被配置为与要冷却的靶接触 。 支撑构件在远离冷却构件的位置处支撑多个传热构件，使得多个传热构件中的每一个独立地可移动以与冷却构件接触。

公开(公告)号：US20120033382A1

公开(公告)日：2012-02-09

申请号：US13167230

申请日：2011-06-23

申请人： Yosuke Tsunoda ,  Masumi Suzuki ,  Michimasa Aoki ,  Masaru Sugie ,  Shinichirou Kouno ,  Hiroshi Muto ,  Kenji Katsumata

发明人： Yosuke Tsunoda ,  Masumi Suzuki ,  Michimasa Aoki ,  Masaru Sugie ,  Shinichirou Kouno ,  Hiroshi Muto ,  Kenji Katsumata

IPC分类号： H05K7/20 ,  F28D15/00 ,  F28F7/00

CPC分类号： F28D15/043 ,  F28D15/0233 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for absorbing heat which is generated by an electronic module by using a coolant which flows in its internal portion, comprises a housing which is provided with, in its internal portion, a first surface which is located in the vicinity of the electronic module and a second surface which faces the first surface and comprises fins which extend from the first surface toward the second surface, wherein a projecting portion projecting from the second surface toward the first surface is formed at the second surface, between the top edges of the fins on the second surface side and the second surface.

摘要翻译： 一种用于吸收由电子模块产生的热量的散热片，其通过使用在其内部部分流动的冷却剂而包括壳体，该壳体在其内部设有位于电子模块附近的第一表面 以及面对所述第一表面的第二表面，并且包括从所述第一表面朝向所述第二表面延伸的翅片，其中在所述第二表面处形成从所述第二表面朝向所述第一表面突出的突出部分， 在第二表面侧和第二表面上。