Radiator and electronic apparatus having coolant pathway
    1.
    发明申请
    Radiator and electronic apparatus having coolant pathway 审中-公开
    具有冷却剂通道的散热器和电子设备

    公开(公告)号:US20120055654A1

    公开(公告)日:2012-03-08

    申请号:US13137654

    申请日:2011-08-31

    IPC分类号: F28F13/00 F28D1/00

    摘要: A radiator includes a core unit, which includes a flow inlet which coolant enters, a flow outlet from which the coolant exits, a plurality of coolant pathways including at least an outer coolant pathway, an inner coolant pathway, a branching point, and a merging point, the outer coolant pathway being disposed to surround the inner coolant pathway, the coolant being divided at the branching point and merging at the merging point, and a connecting pathway to connect between the merging point of the outer coolant pathway and the branching point of the inner coolant pathway, wherein the flow inlet is in communication with a branching point of an outermost one of the plurality of coolant pathways, and the flow output is in communication with a merging point of an innermost one of the plurality of coolant pathways.

    摘要翻译: 散热器包括芯单元,其包括冷却剂进入的流入口,冷却剂从其流出的流出口,多个冷却剂通路,至少包括外部冷却剂通道,内部冷却剂通道,分支点和合并 所述外部冷却剂通道被设置为围绕所述内部冷却剂通道,所述冷却剂在所述分支点处被分割并在所述汇合点处汇合,以及连接路径以连接所述外部冷却剂通道的汇合点和所述外部冷却剂通道的分支点 所述内部冷却剂通道,其中所述流入口与所述多个冷却剂通道中的最外部冷却剂通道的分支点连通,并且所述流动输出与所述多个冷却剂通道中的最内部冷却剂通道的汇合点连通。

    HEAT SINK, LIQUID COOLING UNIT, AND ELECTRONIC APPARATUS
    4.
    发明申请
    HEAT SINK, LIQUID COOLING UNIT, AND ELECTRONIC APPARATUS 审中-公开
    散热器,液体冷却单元和电子设备

    公开(公告)号:US20120055655A1

    公开(公告)日:2012-03-08

    申请号:US13198899

    申请日:2011-08-05

    IPC分类号: F28F13/00 F28F7/00

    CPC分类号: G06F1/203

    摘要: A heat sink for absorbing heat which is generated by an electronic module by a coolant which flows through its internal portion, provided with a first heat sink part which is contiguous with the electronic module, a second heat sink part which is contiguous with the electronic module, and a heat discharger which is arranged spaced from the first heat sink part and second heat sink part at an opposite side from the electronic module and which is arranged in a flow path between the first heat sink part and second heat sink part.

    摘要翻译: 一种用于吸收热量的散热器,其由通过其内部部分流过的冷却剂由电子模块产生,设置有与所述电子模块邻接的第一散热部分,与所述电子模块邻接的第二散热器部分 以及放热器,其与第一散热部和第二散热部隔开设置在与电子模块相反的一侧,并且布置在第一散热部和第二散热部之间的流路中。

    Fibrous particle generating apparatus and test system
    6.
    发明授权
    Fibrous particle generating apparatus and test system 失效
    纤维颗粒发生装置和试验系统

    公开(公告)号:US08176802B2

    公开(公告)日:2012-05-15

    申请号:US12275350

    申请日:2008-11-21

    CPC分类号: B02C19/20 G01M99/00

    摘要: There is provided a fibrous particle generating apparatus and a test system. The fibrous particle generating apparatus includes a base material containing a fibrous material; a holding unit holding the base material; a fibrous particle generator generating fibrous particles by chafing the base material; and a movement unit moving the holding unit such that the base material held by holding unit is chafed against the fibrous particle generator. With this configuration, fibrous particles can be stably generated, and an evaluation of the object apparatus can be carried out on the basis of the generated fibrous particles.

    摘要翻译: 提供了纤维颗粒发生装置和测试系统。 纤维颗粒发生装置包括含有纤维材料的基材; 保持所述基材的保持单元; 纤维颗粒发生器,通过擦洗基材产生纤维颗粒; 以及移动单元,使所述保持单元移动,使得由保持单元保持的基材被擦伤所述纤维颗粒发生器。 利用这种构造,可以稳定地产生纤维颗粒,并且可以基于所生成的纤维颗粒进行对象装置的评价。

    Semiconductor device having a flat protective adhesive sheet
    8.
    发明授权
    Semiconductor device having a flat protective adhesive sheet 失效
    具有平坦的保护性粘合片的半导体装置

    公开(公告)号:US06787929B2

    公开(公告)日:2004-09-07

    申请号:US09785464

    申请日:2001-02-20

    IPC分类号: H01L2329

    摘要: A semiconductor device has a semiconductor wafer having sensing portions exposed on a surface thereof and an adhesive sheet attached to the semiconductor wafer as a protective cap to cover the sensing portions. The adhesive sheet is composed of a flat adhesive sheet and adhesive disposed generally on an entire surface of the adhesive sheet. Adhesion of the adhesive is selectively reduced by UV irradiation to have adhesion reduced regions, and the adhesion reduced regions face the sensing portions. The protective cap can be produced with high productivity, and securely protect the sensing portions when the semiconductor wafer is diced and is transported.

    摘要翻译: 半导体器件具有其表面上具有感测部分的半导体晶片和附接到半导体晶片的粘合片作为保护盖以覆盖感测部分。 粘合片由通常在粘合片的整个表面上设置的平坦粘合片和粘合剂构成。 通过UV照射选择性地降低粘合剂的粘附性以具有粘合减少区域,并且粘合降低区域面对感测部分。 可以以高生产率制造保护盖,并且在半导体晶片被切割并被输送时可靠地保护感测部分。