摘要:
A radiator includes a core unit, which includes a flow inlet which coolant enters, a flow outlet from which the coolant exits, a plurality of coolant pathways including at least an outer coolant pathway, an inner coolant pathway, a branching point, and a merging point, the outer coolant pathway being disposed to surround the inner coolant pathway, the coolant being divided at the branching point and merging at the merging point, and a connecting pathway to connect between the merging point of the outer coolant pathway and the branching point of the inner coolant pathway, wherein the flow inlet is in communication with a branching point of an outermost one of the plurality of coolant pathways, and the flow output is in communication with a merging point of an innermost one of the plurality of coolant pathways.
摘要:
A heat sink for absorbing heat which is generated by an electronic module by using a coolant which flows in its internal portion, comprises a housing which is provided with, in its internal portion, a first surface which is located in the vicinity of the electronic module and a second surface which faces the first surface and comprises fins which extend from the first surface toward the second surface, wherein a projecting portion projecting from the second surface toward the first surface is formed at the second surface, between the top edges of the fins on the second surface side and the second surface.
摘要:
A cooling jacket includes: first and second pipe portions through which a coolant flows; and a main portion connected with side surfaces of the first and second pipe portions, defining, with a single member, a flow path through which the coolant flows, and cooling an object to be cooled.
摘要:
A heat sink for absorbing heat which is generated by an electronic module by a coolant which flows through its internal portion, provided with a first heat sink part which is contiguous with the electronic module, a second heat sink part which is contiguous with the electronic module, and a heat discharger which is arranged spaced from the first heat sink part and second heat sink part at an opposite side from the electronic module and which is arranged in a flow path between the first heat sink part and second heat sink part.
摘要:
A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube.
摘要:
There is provided a fibrous particle generating apparatus and a test system. The fibrous particle generating apparatus includes a base material containing a fibrous material; a holding unit holding the base material; a fibrous particle generator generating fibrous particles by chafing the base material; and a movement unit moving the holding unit such that the base material held by holding unit is chafed against the fibrous particle generator. With this configuration, fibrous particles can be stably generated, and an evaluation of the object apparatus can be carried out on the basis of the generated fibrous particles.
摘要:
A slurry composition is described, which comprises 100 parts by weight of a raw mineral material for white ware and/or a raw mineral material for advanced ceramics, from 0.5 to 20 parts by weight of a re-dispersible resin powder, and water. A shaping using the slurry composition and a fired body are also described.
摘要:
A semiconductor device has a semiconductor wafer having sensing portions exposed on a surface thereof and an adhesive sheet attached to the semiconductor wafer as a protective cap to cover the sensing portions. The adhesive sheet is composed of a flat adhesive sheet and adhesive disposed generally on an entire surface of the adhesive sheet. Adhesion of the adhesive is selectively reduced by UV irradiation to have adhesion reduced regions, and the adhesion reduced regions face the sensing portions. The protective cap can be produced with high productivity, and securely protect the sensing portions when the semiconductor wafer is diced and is transported.
摘要:
A semiconductor acceleration sensor, which prevents an adhesion of a movable portion to a fixed portion due to an electrostatic force generated during being handled. The acceleration sensor has a sensor portion and a handling portion. The sensor portion has a first semiconductor layer; a movable portion including a weight portion supported to the first semiconductor layer for moving in accordance with an acceleration externally applied thereto and movable electrodes integrally formed with the weight portion; and fixed electrodes having a detection surface confronted to a detection surface of the movable electrodes and supported to the first semiconductor layer. The handling portion is to be contacted during being handled, and is provided at surrounding portion of the sensor portion with a trench interposed therebetween. The sensor portion is electrically insulated from the handling portion by the trench.
摘要:
A semiconductor accelerometer device is formed on an SOI substrate by micro-machining. A movable unit is supported at both ends, and a weight portion is movable in response to acceleration exerted in the detection direction. A movable electrode is formed in a comb shape integrally with the weight portion. A pair of fixed electrodes in a comb shape are cantilevered and interleaved with the movable electrode to face the movable electrode. A plurality of through holes is provided in the electrodes so that the electrodes have Rahmen structure which is a series of rectangular frames. This structure reduces the weight of each electrode while increasing the strength against twist force. The electrodes are less likely from breaking in response to an acceleration exerted in a direction perpendicular to the normal detection direction because of reduced weight.