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    Package structure with a retarding structure and method of making same
    1.
    发明授权
    Package structure with a retarding structure and method of making same 失效
    具有延迟结构的封装结构及其制造方法

    公开(公告)号：US07067358B2

    公开(公告)日：2006-06-27

    申请号：US11134988

    申请日：2005-05-23

    申请人： Huang Chen-Tung ,  Tu Jim-Tren ,  You Hsang-Hsing ,  Lu Huang-An ,  Chang Ming-Lan ,  Lee Tai-Ying

    发明人： Huang Chen-Tung ,  Tu Jim-Tren ,  You Hsang-Hsing ,  Lu Huang-An ,  Chang Ming-Lan ,  Lee Tai-Ying

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H01L23/315 ,  H01L23/16 ,  H01L23/3121 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/83365 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/12041 ,  Y10T29/49146 ,  H01L2224/05599

    摘要： An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic device in the conventional arts. The present invention provides a package structure with a retarding structure to efficiently avoid the problem. The package structure comprises an electronic device, a substrate, a retarding structure, and an encapsulant. The substrate has conductive contacts disposed on an upper surface. The electronic device has an active region and conductive pads disposed on a first surface. The electronic device is electrically coupled to the substrate by conductive bumps between the conductive contacts and the corresponding conductive pads. The encapsulant is formed around a periphery of the electronic device. The retarding structure is disposed outside the active region on the first surface of the electronic device for avoiding the encapsulant contacting the active region of the electronic device.

    摘要翻译： 密封剂容易地流入基板和电子设备之间的空间，并且与电子设备的有源区域接触以影响电子设备在传统技术中的特性。 本发明提供一种具有延迟结构的封装结构，以有效地避免该问题。 封装结构包括电子器件，衬底，延迟结构和密封剂。 基板具有设置在上表面上的导电触点。 电子设备具有有源区和设置在第一表面上的导电焊盘。 电子器件通过导电触点和对应的导电焊盘之间的导电凸块电耦合到衬底。 密封剂围绕电子设备的周边形成。 延迟结构设置在电子设备的第一表面上的有源区域的外部，以避免密封剂接触电子器件的有源区域。