公开(公告)号：US06858123B1

公开(公告)日：2005-02-22

申请号：US10070000

申请日：2000-08-25

Applicant: Jung-Chih Hu ,  Wu-Chun Gau ,  Ting-Chang Chang ,  Ming-Shiann Feng ,  Chun-Lin Cheng ,  You-Shin Lin ,  Ying-Hao Li ,  Lih-Juann Chen

Inventor： Jung-Chih Hu ,  Wu-Chun Gau ,  Ting-Chang Chang ,  Ming-Shiann Feng ,  Chun-Lin Cheng ,  You-Shin Lin ,  Ying-Hao Li ,  Lih-Juann Chen

IPC: C25D3/38 ,  C25D7/12 ,  H01L21/28 ,  H01L21/288 ,  C23C18/00

CPC classification number: C25D3/38

Abstract: The invention relates to a novel galvanizing solution for the galvanic deposition of copper. Hydroxylamine sulfate or hydroxylamine hydrochloride are utilized as addition reagents and added to the galvanizing solution during the galvanic deposition of copper which is used in the manufacture of semiconductors.

Abstract translation: 本发明涉及一种用于铜的电沉积的新型镀锌溶液。 使用硫酸羟胺或盐酸羟胺作为添加剂，并在用于制造半导体的铜的电沉积期间加入到镀锌溶液中。