公开(公告)号：US20090140439A1

公开(公告)日：2009-06-04

申请号：US12364475

申请日：2009-02-02

申请人： Chull Won Ju ,  Byoung Gue Min ,  Seong II Kim ,  Jong Min Lee ,  Kyung Ho Lee ,  Young II Kang

发明人： Chull Won Ju ,  Byoung Gue Min ,  Seong II Kim ,  Jong Min Lee ,  Kyung Ho Lee ,  Young II Kang

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541

摘要： Provided are a chip, a chip stack, and a method of manufacturing the Same. A plurality of chips which each include: at least one pad formed on a wafer; and a metal layer which protrudes up to a predetermined thickness from the bottom of the wafer and is formed in a via hole exposing the bottom of the pad are stacked such that the pad and the metal layer of adjacent chips are bonded. This leads to a simplified manufacturing process, high chip performance and a small footprint for a chip stack.

摘要翻译： 提供了芯片，芯片堆叠以及制造该芯片的方法。 多个芯片，每个芯片包括：形成在晶片上的至少一个焊盘; 并且从晶片的底部突出到预定厚度并且形成在露出焊盘底部的通孔中的金属层被堆叠成使得焊盘和相邻芯片的金属层接合。 这导致了简化的制造工艺，高芯片性能和用于芯片堆叠的小占地面积。