Abstract:
The present invention provides a touch display device, which includes a display module and a touch panel. The display module includes a display panel and a control chip disposed on the display module to control the display module. The touch panel has a glass substrate and a driving chip disposed on the glass substrate to control at least one touching operation for the touch panel. The driving chip and the control chip are disposed in a misaligned manner.
Abstract:
An extruding mechanism includes a retaining base, a first handle provided for handling, a push rod pivotally coupled and having both ends extended out from a retaining base, a first resilient member and a first latch plate pivotally connected to a push rod in the retaining base; a poking member disposed on the retaining base; a second handle installed on the retaining base and having a driving arm at an end of the second handle, such that when the driving arm is turned clockwise or counterclockwise, the push rod can be shifted directly or indirectly by the first latch plate in the retaining base after being pressed by the poking member.
Abstract:
The extruding implement structure of the present invention comprises a handle pivotally connected to a rear base and disposed on one side of the base, and is substantially parallel to the base or in an aslant position, using a first resisting arm to press against a pushing member of a first exerting arm pivotally coupled to a rear base, and the pushing member uses a second resisting arm on the other end of the pivotal point to press against the first latch plate and drive the push rod to push and press against the silicon gel can for the gel injection. A latch member is disposed between the outside of the rear base and the second latch plate such that the silicon gel will not keep on squeezing the silicon gel after the operation is stopped.
Abstract:
The described embodiments relate generally to the singulation of circuits and more particularly to a method of cutting of a polymer substrate that is overlaid with a conductive element and a passivation layer. In one embodiment, the passivation layer is applied selectively to the polymer substrate in an area covering the conductive element and extending at least a first distance past an outer edge of the conductive element. Then, a cutting operation is performed along a cutting path located a second distance from an outer edge of the passivation layer. The second distance is a minimum distance between the edge of the passivation layer and the cutting path that prevents a load applied at the second distance from causing a stress crack in the passivation layer.
Abstract:
An organic light emitting diode display panel element and a method for manufacturing the same are provided. The element comprises a substrate, a conductive wire layer, a protective layer, an organic light emitting diode structure, and a package body. It first makes the conductive wire layer on the substrate, then coats protective glue on a display area and a non-display area on the substrate, evaporates the organic light emitting diode structure on the display area on the substrate and connects it to the conductive wire layer (connection with electricity conductive ability), and packages the organic light emitting diode structure on the substrate. Therefore, twice protective glue coating process is not needed, it is easy to process the coating process, and the protective glue is more adhesive to the substrate, thus reducing process steps and processing time, meanwhile reducing process expenses.
Abstract:
A display system having a capacitive touch panel is described. The capacitive touch panel includes an electrode circuit formed on a substrate. The electrode circuit has a first electrode including a plurality of first conducting patterns and a second electrode including a plurality of second conducting patterns. The first conducting patterns are electrically connected to each other. A plurality of signal wires is formed on the substrate. A dielectric layer covers the electrode circuit. An electrode bridge structure is formed on the dielectric layer and is electrically connected to the second conducting patterns of the electric circuit, such that the second conducting patterns are electrically connected to each other. The electrode bridge structure having uniform thickness is formed by the metal open repair technique. A method of manufacturing a display system is also described.
Abstract:
An electrode structure of multiple dielectric island layer and manufacturing method thereof are described. The electrode structure includes a substrate, an electrode bridge structure, a dielectric layer and a conducting pattern. The dielectric layer is formed on the substrate and the electrode bridge structure and has a plurality of dielectric island patterns. The dielectric island patterns cover a portion of the electrode bridge structure for forming a plurality of bridge patterns of the electrode bridge structure wherein the dielectric island patterns are alternately arranged with the bridge patterns. The conducting pattern has a first electrode, a second electrode, a third electrode and a fourth electrode. The first electrode is electrically connected to the second electrode. The third and fourth electrodes cover the bridge patterns of the electrode bridge structure for reducing the contact resistance between the third and fourth electrodes by the electrode bridge structure.