公开(公告)号：US4826726A

公开(公告)日：1989-05-02

申请号：US877944

申请日：1986-06-24

申请人： Masahiko Maeda ,  Ryutaro Fujihira ,  Yoshihiro Moteki ,  Naotoshi Watanabe ,  Yuichi Sakon

发明人： Masahiko Maeda ,  Ryutaro Fujihira ,  Yoshihiro Moteki ,  Naotoshi Watanabe ,  Yuichi Sakon

IPC分类号： H01B3/40 ,  H01B3/44 ,  B32B15/00 ,  H01B7/00

CPC分类号： H01B3/44 ,  H01B3/40 ,  Y10T428/2933 ,  Y10T428/294 ,  Y10T428/2947

摘要： A heat-resistnat wire is disclosed which comprises a line of copper or aluminum coated with a shielding material obtained by heating a mixture of: (A) an ethylenic copolymer comprised of ethylene and 0.1 to 20.0 mol % of a monomer of at most 30 carbon atoms having an oxirane group or a hydroxyl group and having at least one double bond; and (B) an ethylenic copolymer comprised of ethylene and 0.1 to 20.0 mol % of a monomer possessing a functional group capable of reacting with oxirane group or hydroxy group in the ethylenic copolymer (A). The wire is excellent not only in heat resistance but also in insulating ability and flexibility.

摘要翻译： 公开了一种耐热线，其包括涂覆有屏蔽材料的铜或铝线，所述屏蔽材料通过加热以下混合物而获得：（A）由乙烯和0.1至20.0摩尔％的至多30碳的单体组成的乙烯类共聚物 具有环氧乙烷基或羟基并具有至少一个双键的原子; 和（B）在乙烯类共聚物（A）中由乙烯和0.1〜20.0摩尔％的具有能够与环氧乙烷基或羟基反应的官能团的单体组成的乙烯类共聚物。 该电线不仅具有耐热性，而且在绝缘性和柔韧性方面也是优异的。

公开(公告)号：US4751146A

公开(公告)日：1988-06-14

申请号：US883662

申请日：1986-07-09

申请人： Masahiko Maeda ,  Kazuya Nagata ,  Yasutoki Saitou ,  Taketsugu Ootani ,  Yuichi Sakon

发明人： Masahiko Maeda ,  Kazuya Nagata ,  Yasutoki Saitou ,  Taketsugu Ootani ,  Yuichi Sakon

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  B32B27/08 ,  B32B3/00 ,  B32B15/08

CPC分类号： H05K3/0014 ,  H05K1/0326 ,  H05K1/036 ,  H05K3/0064 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2203/1327 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31692 ,  Y10T428/31743

摘要： A heat resistant printed circuit board is disclosed which comprises a laminate of:(A) a thin-walled body having a thickness of from 0.2 .mu.m to less than 5 mm and containing a cross-linked product of a mixture of (a) 1 to 99 wt. % of an ethylenic copolymer (A) comprised of 30 to 99.5 wt. % of ethylene, and an oxirane ring-containing compound having at least one double bond and having 6 to 30 carbon atoms, and (b) 99 to 1 wt. % of an ethylenic copolymer (B) comprised of 30 to 99.5 wt. % of ethylene, and a comonomer selected from the group consisting of unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated dicarboxylic acid anhydrides, and half esters of unsaturated dicarboxylic acids; and(B) an electrically conductive metal layer having a thickness of from 100 .ANG. to 400 .mu.m.The boards have excellent heat resistance, electrical insulating properties, flexibility, chemical resistance, dimensional stability, etc.

摘要翻译： 公开了一种耐热印刷电路板，其包括层压体：（A）厚度为0.2μm至小于5mm的薄壁体，并且含有（a）1的混合物的交联产物 至99重量％ 乙烯共聚物（A）的％为30〜99.5重量％ ％的乙烯和具有至少一个双键并且具有6至30个碳原子的环氧乙烷环的化合物，和（b）99至1wt。 乙烯共聚物（B）的％为30〜99.5重量％ ％的乙烯和选自不饱和一元羧酸，不饱和二羧酸，不饱和二羧酸酐和不饱和二羧酸的半酯的共聚单体; 和（B）厚度为100〜400μm的导电性金属层。 这些板具有优异的耐热性，电绝缘性，柔韧性，耐化学性，尺寸稳定性等。