Heat dissipation system
    1.
    发明授权
    Heat dissipation system 有权
    散热系统

    公开(公告)号:US08848363B2

    公开(公告)日:2014-09-30

    申请号:US13152410

    申请日:2011-06-03

    IPC分类号: G06F1/20 H05K7/20

    CPC分类号: G06F1/20

    摘要: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.

    摘要翻译: 散热系统包括具有基板和垂直于基板的背板的计算机外壳,与底板相邻的基板上的主板和主板旁边的大容量存储装置。 主板上有散热片和散热片上的第一个风扇。 基板在主板旁边有一个第二个风扇。 第二个风扇与背板相邻。 大容量存储装置远离背板。 第一风扇以这样的方式旋转,使得气流被吸入计算机外壳中,流过散热器并被排出计算机外壳。 第二风扇以这样的方式旋转,使得气流被吸入计算机外壳中,流过大容量存储装置并被排出计算机外壳。

    All-in-one computer
    2.
    发明授权
    All-in-one computer 失效
    一体机电脑

    公开(公告)号:US08456829B2

    公开(公告)日:2013-06-04

    申请号:US12945675

    申请日:2010-11-12

    IPC分类号: G06F1/16

    CPC分类号: G06F1/20

    摘要: A computer includes an enclosure and a mainframe module enclosed in the enclosure. The mainframe module includes a base board, a motherboard, a partition panel perpendicularly attached on the base board, and a fan. The motherboard and the fan are attached on the base board at opposite sides of the partition panel. The fan is capable of blowing air to the motherboard to cool heat generating components of the motherboard.

    摘要翻译: 计算机包括一个外壳和一个封闭在外壳内的主机模块。 主机模块包括基板,母板,垂直安装在基板上的分隔板和风扇。 主板和风扇安装在分隔板相对两侧的基板上。 风扇能够将空气吹到主板上,以冷却主板的发热部件。

    COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT
    3.
    发明申请
    COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT 审中-公开
    具有气流导向导管的计算机系统

    公开(公告)号:US20120327589A1

    公开(公告)日:2012-12-27

    申请号:US13408010

    申请日:2012-02-29

    IPC分类号: H05K7/20

    CPC分类号: G06F1/20 G06F1/181

    摘要: A computer includes a computer case and an airflow guiding duct. The computer case includes a rear plate with a number of air outlets. A bracket and a first fan are received in the case. The bracket receives a number of first heat generating components and includes a mounting plate with a number of through holes. A heat sink and a second fan are received in the case, and the second fan is attached to the heat sink for absorbing heat generated by a second heat generating component. The duct defines an hole and an opening. The through holes, the first fan, the hole, and the air outlets define a first airflow passage for cooling the first heat generating components, and the second fan, the opening, the hole, and the air outlets define a second airflow passage for cooling the second heat generating component.

    摘要翻译: 计算机包括计算机外壳和气流引导导管。 该计算机外壳包括具有多个空气出口的后板。 一个支架和一个第一个风扇被接收在外壳中。 支架接收多个第一发热部件,并且包括具有多个通孔的安装板。 散热器和第二风扇被容纳在壳体中,并且第二风扇附接到散热器以吸收由第二发热部件产生的热量。 管道限定孔和开口。 通孔,第一风扇,孔和空气出口限定用于冷却第一发热部件的第一气流通道,并且第二风扇,开口,孔和空气出口限定第二气流通道,用于冷却 第二发热部件。

    Heat dissipating apparatus
    4.
    发明授权
    Heat dissipating apparatus 失效
    散热装置

    公开(公告)号:US08335082B2

    公开(公告)日:2012-12-18

    申请号:US13095863

    申请日:2011-04-28

    IPC分类号: H05K7/20

    CPC分类号: G06F1/20

    摘要: A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.

    摘要翻译: 散热装置包括冷却器,风道和冷却风扇。 固定在主机电路板上的冷却器; 冷却器固定在主机的电路板上; 空气管道覆盖冷却器,包括基本垂直于电路板的侧托盘; 冷却风扇被固定到冷却器并且位于冷却器的一侧并且靠近侧托盘; 在侧托盘和冷却器之间限定了间隙,空气引导板位于间隙中并且朝向固定到电路板的VRM延伸,并且空气引导板被配置为引导朝向VRM流动的空气。

    OBTAINING HIERARCHICAL INFORMATION OF PLANAR DATA
    5.
    发明申请
    OBTAINING HIERARCHICAL INFORMATION OF PLANAR DATA 有权
    获取平面数据的分层信息

    公开(公告)号:US20120173585A1

    公开(公告)日:2012-07-05

    申请号:US13332361

    申请日:2011-12-20

    IPC分类号: G06F17/30

    摘要: The invention provides a method and apparatus for obtaining hierarchical information of planar data. The method comprises mapping at least one data item from a same data set in the planar data to at least one node in a tree structure formed by a structured terminology system. The method also comprises obtaining at least one sub tree structure in the tree structure, each of the at least one sub tree structure taking the at least one node as all of its leaf node. The method also comprises selecting a target tree structure from the at least one sub tree structure and obtaining hierarchical information in the target tree structure. An apparatus corresponding to the above method is also provided. With the above method and apparatus, hierarchical information of data items may be obtained from planar organized data to facilitate subsequent and further analysis and management.

    摘要翻译: 本发明提供了一种获取平面数据分层信息的方法和装置。 该方法包括将平面数据中的相同数据集中的至少一个数据项映射到由结构化术语系统形成的树结构中的至少一个节点。 所述方法还包括获得所述树结构中的至少一个子树结构,所述至少一个子树结构中的每一个将所述至少一个节点作为其所有叶节点。 该方法还包括从至少一个子树结构中选择目标树结构并获得目标树结构中的分层信息。 还提供了与上述方法对应的装置。 利用上述方法和装置,可以从平面有组织的数据获得数据项的分层信息,以便于后续和进一步的分析和管理。

    HEAT DISSIPATION SYSTEM
    6.
    发明申请
    HEAT DISSIPATION SYSTEM 有权
    散热系统

    公开(公告)号:US20120147546A1

    公开(公告)日:2012-06-14

    申请号:US13152410

    申请日:2011-06-03

    IPC分类号: H05K7/20

    CPC分类号: G06F1/20

    摘要: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.

    摘要翻译: 散热系统包括具有基板和垂直于基板的背板的计算机外壳,与底板相邻的基板上的主板和主板旁边的大容量存储装置。 主板上有散热片和散热片上的第一个风扇。 基板在主板旁边有一个第二个风扇。 第二个风扇与背板相邻。 大容量存储装置远离背板。 第一风扇以这样的方式旋转,使得气流被吸入计算机外壳中,流过散热器并被排出计算机外壳。 第二风扇以这样的方式旋转,使得气流被吸入计算机外壳中,流过大容量存储装置并被排出计算机外壳。

    CAGE TERMINAL FOR AN ELECTRIC DEVICE AND AN ELECTRIC DEVICE USING THE SAME
    7.
    发明申请
    CAGE TERMINAL FOR AN ELECTRIC DEVICE AND AN ELECTRIC DEVICE USING THE SAME 审中-公开
    用于电气设备的电缆终端和使用该设备的电气设备

    公开(公告)号:US20120071035A1

    公开(公告)日:2012-03-22

    申请号:US13236103

    申请日:2011-09-19

    IPC分类号: H01R4/36 H01R4/28

    CPC分类号: H01R4/48

    摘要: A cage terminal is disclosed for an electric device, the cage terminal, in at least one embodiment, being detachably connected to the electric device and pressing a wire detachably onto a connecting tab of the electric device. In at least one embodiment, it does not need to develop different products of electric device with the same body but different wired terminals, and it is convenient for the electric device to change different terminals, thus reducing the development, production and use costs of the electric device and facilitating the operation thereof.

    摘要翻译: 公开了一种用于电气设备的笼式端子,在至少一个实施例中,笼式端子可拆卸地连接到电气设备并将电线可拆卸地按压到电气设备的连接接头上。 在至少一个实施例中,不需要开发具有相同身体但不同的有线终端的电气设备的不同产品,并且电气设备改变不同的终端是方便的,从而减少开发,生产和使用成本 电气设备并且便于其操作。

    ENCLOSURE OF ELECTRONIC DEVICE
    8.
    发明申请
    ENCLOSURE OF ELECTRONIC DEVICE 审中-公开
    电子设备外壳

    公开(公告)号:US20110304978A1

    公开(公告)日:2011-12-15

    申请号:US12939161

    申请日:2010-11-03

    IPC分类号: G06F1/20 H05K7/20

    CPC分类号: G06F1/20

    摘要: An enclosure of an electronic device includes a bottom wall and a sidewall. A motherboard is mounted on the bottom wall. The motherboard includes a heat generation apparatus and a heat sink attached thereon. The heat sink is in contact with the heat generation apparatus, and is configured to transmit heat from the heat generation apparatus to the heat sink. The sidewall defines a number of vents, which are in alignment with the heat sink. A fan is mounted between the sidewall and the heat sink with an air inlet side of the fan directed towards the heat sink and an air outlet side of the fan directed towards the plurality of vents.

    摘要翻译: 电子设备的外壳包括底壁和侧壁。 主板安装在底壁上。 主板包括附着在其上的发热装置和散热器。 散热器与发热装置接触,并且被配置为将热量从发热装置传递到散热器。 侧壁限定了与散热器对准的多个通风口。 风扇安装在侧壁和散热器之间,风扇的空气入口侧朝向散热器,风扇的空气出口侧朝向多个通风口。

    Printed circuit board assembly
    9.
    发明授权
    Printed circuit board assembly 失效
    印刷电路板组装

    公开(公告)号:US08072763B2

    公开(公告)日:2011-12-06

    申请号:US12728587

    申请日:2010-03-22

    IPC分类号: H05K7/20 G06F1/20

    摘要: A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.

    摘要翻译: 印刷电路板组件包括散热器,背板和固定构件。 散热器被配置为安装在印刷电路板的发热元件上。 散热器被配置为消散由发热元件产生的热量。 散热器和背板被配置为放置在印刷电路板的相对侧上。 散热器包括第一连接热管。 背板包括第二连接热管。 第二连接热管接触第一连接热管。 固定构件热接触第一连接热管和第二连接热管。

    Obtaining hierarchical information of planar data
    10.
    发明授权
    Obtaining hierarchical information of planar data 有权
    获取平面数据的分层信息

    公开(公告)号:US08996581B2

    公开(公告)日:2015-03-31

    申请号:US13332361

    申请日:2011-12-20

    IPC分类号: G06F7/00 G06F17/30 G06Q50/24

    摘要: The invention provides a method and apparatus for obtaining hierarchical information of planar data. The method comprises mapping at least one data item from a same data set in the planar data to at least one node in a tree structure formed by a structured terminology system. The method also comprises obtaining at least one sub tree structure in the tree structure, each of the at least one sub tree structure taking the at least one node as all of its leaf node. The method also comprises selecting a target tree structure from the at least one sub tree structure and obtaining hierarchical information in the target tree structure. An apparatus corresponding to the above method is also provided. With the above method and apparatus, hierarchical information of data items may be obtained from planar organized data to facilitate subsequent and further analysis and management.

    摘要翻译: 本发明提供了一种获取平面数据分层信息的方法和装置。 该方法包括将平面数据中的相同数据集中的至少一个数据项映射到由结构化术语系统形成的树结构中的至少一个节点。 所述方法还包括获得所述树结构中的至少一个子树结构,所述至少一个子树结构中的每一个将所述至少一个节点作为其所有叶节点。 该方法还包括从至少一个子树结构中选择目标树结构并获得目标树结构中的分层信息。 还提供了与上述方法对应的装置。 利用上述方法和装置,可以从平面有组织的数据获得数据项的分层信息,以便于后续和进一步的分析和管理。