摘要:
A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.
摘要:
A computer includes an enclosure and a mainframe module enclosed in the enclosure. The mainframe module includes a base board, a motherboard, a partition panel perpendicularly attached on the base board, and a fan. The motherboard and the fan are attached on the base board at opposite sides of the partition panel. The fan is capable of blowing air to the motherboard to cool heat generating components of the motherboard.
摘要:
A computer includes a computer case and an airflow guiding duct. The computer case includes a rear plate with a number of air outlets. A bracket and a first fan are received in the case. The bracket receives a number of first heat generating components and includes a mounting plate with a number of through holes. A heat sink and a second fan are received in the case, and the second fan is attached to the heat sink for absorbing heat generated by a second heat generating component. The duct defines an hole and an opening. The through holes, the first fan, the hole, and the air outlets define a first airflow passage for cooling the first heat generating components, and the second fan, the opening, the hole, and the air outlets define a second airflow passage for cooling the second heat generating component.
摘要:
A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.
摘要:
The invention provides a method and apparatus for obtaining hierarchical information of planar data. The method comprises mapping at least one data item from a same data set in the planar data to at least one node in a tree structure formed by a structured terminology system. The method also comprises obtaining at least one sub tree structure in the tree structure, each of the at least one sub tree structure taking the at least one node as all of its leaf node. The method also comprises selecting a target tree structure from the at least one sub tree structure and obtaining hierarchical information in the target tree structure. An apparatus corresponding to the above method is also provided. With the above method and apparatus, hierarchical information of data items may be obtained from planar organized data to facilitate subsequent and further analysis and management.
摘要:
A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.
摘要:
A cage terminal is disclosed for an electric device, the cage terminal, in at least one embodiment, being detachably connected to the electric device and pressing a wire detachably onto a connecting tab of the electric device. In at least one embodiment, it does not need to develop different products of electric device with the same body but different wired terminals, and it is convenient for the electric device to change different terminals, thus reducing the development, production and use costs of the electric device and facilitating the operation thereof.
摘要:
An enclosure of an electronic device includes a bottom wall and a sidewall. A motherboard is mounted on the bottom wall. The motherboard includes a heat generation apparatus and a heat sink attached thereon. The heat sink is in contact with the heat generation apparatus, and is configured to transmit heat from the heat generation apparatus to the heat sink. The sidewall defines a number of vents, which are in alignment with the heat sink. A fan is mounted between the sidewall and the heat sink with an air inlet side of the fan directed towards the heat sink and an air outlet side of the fan directed towards the plurality of vents.
摘要:
A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.
摘要:
The invention provides a method and apparatus for obtaining hierarchical information of planar data. The method comprises mapping at least one data item from a same data set in the planar data to at least one node in a tree structure formed by a structured terminology system. The method also comprises obtaining at least one sub tree structure in the tree structure, each of the at least one sub tree structure taking the at least one node as all of its leaf node. The method also comprises selecting a target tree structure from the at least one sub tree structure and obtaining hierarchical information in the target tree structure. An apparatus corresponding to the above method is also provided. With the above method and apparatus, hierarchical information of data items may be obtained from planar organized data to facilitate subsequent and further analysis and management.