公开(公告)号：US08331589B2

公开(公告)日：2012-12-11

申请号：US12651457

申请日：2010-01-01

申请人： Zhi-Jiang Wu ,  Xing-Fu Chen ,  Yong-Ze Su

发明人： Zhi-Jiang Wu ,  Xing-Fu Chen ,  Yong-Ze Su

IPC分类号： H04R25/00

CPC分类号： H04R1/086 ,  H04R19/005 ,  H04R19/04

摘要： A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity. The housing includes a base and a sidewall extending perpendicularly from the base. A conductive case is provided to cover the cover and the sidewall of the housing. The base defines a periphery portion outside of the cavity for forming a step, and the conductive case locates a bottom end thereof on the step.

摘要翻译： MEMS麦克风包括盖，与盖接合以形成空腔的壳体。 壳体包括从基座垂直延伸的基部和侧壁。 提供导电壳体以覆盖壳体的壳体和侧壁。 底座限定了用于形成台阶的空腔外部的周边部分，并且导电壳体的底端位于台阶上。

公开(公告)号：US20110075875A1

公开(公告)日：2011-03-31

申请号：US12694281

申请日：2010-01-27

申请人： Zhi-Jiang WU ,  Yong-Ze SU

发明人： Zhi-Jiang WU ,  Yong-Ze SU

IPC分类号： H04R9/08 ,  H01L21/02

CPC分类号： B81C1/0023 ,  B81B2201/0257 ,  B81C1/00238

摘要： A MEMS microphone package is disclosed. The MEMS microphone package comprises a housing, a MEMS die and an ASIC chip. The housing includes a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space. The housing defines an acoustic hole for receiving external sound waves. The MEMS die is accommodated in the housing and the MEMS die defines a plurality of first conductive pads. The ASIC chip is accommodated in the housing and the ASIC chip defines a plurality of second conductive pads.

摘要翻译： 公开了一种MEMS麦克风封装。 MEMS麦克风封装包括壳体，MEMS管芯和ASIC芯片。 壳体包括基部，从基部延伸的侧壁和由侧壁支撑的盖，用于形成容纳空间。 壳体限定用于接收外部声波的声孔。 MEMS管芯被容纳在壳体中，并且MEMS管芯限定多个第一导电焊盘。 ASIC芯片容纳在壳体中，并且ASIC芯片限定多个第二导电焊盘。

公开(公告)号：US20100322443A1

公开(公告)日：2010-12-23

申请号：US12694285

申请日：2010-01-27

申请人： Zhi-Jiang WU ,  Xing-Fu CHEN ,  Yong-Ze SU

发明人： Zhi-Jiang WU ,  Xing-Fu CHEN ,  Yong-Ze SU

IPC分类号： H04R3/00

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48137 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R2201/003

摘要： A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity, at least one transducer accommodated in the cavity, and a conductive case covering the cover and the sidewall of the housing. The housing includes a cover and a sidewall extending from the base. The conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

摘要翻译： MEMS麦克风包括盖，与盖形成空腔的壳体，容纳在空腔中的至少一个换能器以及覆盖壳体和壳体侧壁的导电壳体。 壳体包括从基座延伸的盖和侧壁。 导电壳限定覆盖盖的第一部分，从第一部分延伸以覆盖侧壁的第二部分和从第二部分垂直延伸以覆盖基部的周边部分的第三部分，第三部分形成开口。

公开(公告)号：US20100290644A1

公开(公告)日：2010-11-18

申请号：US12626835

申请日：2009-11-27

申请人： ZHI-JIANG WU ,  YONG-ZE SU

发明人： ZHI-JIANG WU ,  YONG-ZE SU

IPC分类号： H04R3/00 ,  H04R11/04

CPC分类号： H04R19/005

摘要： A silicon based capacitive microphone includes a first printed circuit board, a second printed circuit board far away from the first printed circuit board, a transducer electrically mounted on the first printed circuit board, a controlling chip electrically mounted on the second printed circuit board, a connecting member located between the first and second printed circuit boards.

摘要翻译： 基于硅的电容式麦克风包括第一印刷电路板，远离第一印刷电路板的第二印刷电路板，电气安装在第一印刷电路板上的传感器，电气安装在第二印刷电路板上的控制芯片， 连接构件位于第一和第二印刷电路板之间。

公开(公告)号：US08379881B2

公开(公告)日：2013-02-19

申请号：US12626835

申请日：2009-11-27

申请人： Zhi-Jiang Wu ,  Yong-Ze Su

发明人： Zhi-Jiang Wu ,  Yong-Ze Su

IPC分类号： H04R3/00

CPC分类号： H04R19/005

摘要： A silicon based capacitive microphone includes a first printed circuit board, a second printed circuit board far away from the first printed circuit board, a transducer electrically mounted on the first printed circuit board, a controlling chip electrically mounted on the second printed circuit board, a connecting member located between the first and second printed circuit boards.

摘要翻译： 基于硅的电容式麦克风包括第一印刷电路板，远离第一印刷电路板的第二印刷电路板，电气安装在第一印刷电路板上的传感器，电气安装在第二印刷电路板上的控制芯片， 连接构件位于第一和第二印刷电路板之间。

公开(公告)号：US08670579B2

公开(公告)日：2014-03-11

申请号：US12694285

申请日：2010-01-27

申请人： Zhi-Jiang Wu ,  Xing-Fu Chen ,  Yong-Ze Su

发明人： Zhi-Jiang Wu ,  Xing-Fu Chen ,  Yong-Ze Su

IPC分类号： H04R25/00

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48137 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R2201/003

摘要： A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity, at least one transducer accommodated in the cavity, and a conductive case covering the cover and the sidewall of the housing. The housing includes a cover and a sidewall extending from the base. The conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

摘要翻译： MEMS麦克风包括盖，与盖形成空腔的壳体，容纳在空腔中的至少一个换能器以及覆盖壳体和壳体侧壁的导电壳体。 壳体包括从基座延伸的盖和侧壁。 导电壳限定覆盖盖的第一部分，从第一部分延伸以覆盖侧壁的第二部分和从第二部分垂直延伸以覆盖基部的周边部分的第三部分，第三部分形成开口。

公开(公告)号：US20100322451A1

公开(公告)日：2010-12-23

申请号：US12651457

申请日：2010-01-01

申请人： Zhi-Jiang WU ,  Xing-Fu CHEN ,  Yong-Ze SU

发明人： Zhi-Jiang WU ,  Xing-Fu CHEN ,  Yong-Ze SU

IPC分类号： H04R17/02

CPC分类号： H04R1/086 ,  H04R19/005 ,  H04R19/04

摘要： A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity. The housing includes a base and a sidewall extending perpendicularly from the base. A conductive case is provided to cover the cover and the sidewall of the housing. The base defines a periphery portion outside of the cavity for forming a step, and the conductive case locates a bottom end thereof on the step.

摘要翻译： MEMS麦克风包括盖，与盖接合以形成空腔的壳体。 壳体包括从基座垂直延伸的基部和侧壁。 提供导电壳体以覆盖壳体的壳体和侧壁。 底座限定了用于形成台阶的空腔外部的周边部分，并且导电壳体的底端位于台阶上。

公开(公告)号：US20100080405A1

公开(公告)日：2010-04-01

申请号：US12567713

申请日：2009-09-25

申请人： ZHI-JIANG WU ,  MING LIU ,  KAI WANG

发明人： ZHI-JIANG WU ,  MING LIU ,  KAI WANG

IPC分类号： H04R11/04

CPC分类号： H04R1/2838 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1461 ,  H04R1/04 ,  H04R19/005 ,  H04R2499/11 ,  H01L2924/00014 ,  H01L2924/00

摘要： A silicon condenser microphone package includes a printed circuit board, a cover mounted on the printed circuit board, and a transducer unit and a controlling circuit both attached to the printed circuit board. An inner board is located in the cover. The sensitivity and frequency response of the silicon condenser microphone package is desirable.

摘要翻译： 硅电容麦克风封装包括印刷电路板，安装在印刷电路板上的盖，以及连接到印刷电路板的换能器单元和控制电路。 内板位于盖子中。 硅电容麦克风封装的灵敏度和频率响应是理想的。