公开(公告)号：US20190273061A1

公开(公告)日：2019-09-05

申请号：US16461015

申请日：2017-11-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ankit Mahajan ,  Mikhail L. Pekurovsky ,  Matthew S. Stay ,  Daniel J. Theis ,  Ann M. Gillman ,  Shawn C. Dodds ,  Thomas J. Metzler ,  Matthew R.D. Smith ,  Roger W. Barton ,  Joseph E. Hernandez ,  Saagar A. Shah ,  Kara A. Meyers ,  James Zhu ,  Teresa M. Goeddel ,  Lyudmila A. Pekurovsky ,  Jonathan W. Kemling ,  Jeremy K. Larsen ,  Jessica Chiu ,  Kayla C. Niccum

IPC: H01L23/00

Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.