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公开(公告)号:US10971468B2
公开(公告)日:2021-04-06
申请号:US16461015
申请日:2017-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gilman , Shawn C. Dodds , Thomas J. Metzler , Matthew R. D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC: H01L23/00 , H01L23/498 , B81C3/00 , H01L23/544
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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公开(公告)号:US20220011238A1
公开(公告)日:2022-01-13
申请号:US17309068
申请日:2019-11-13
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Francis T. Caruso , Jeffrey K. Eliason , David L. Hofeldt , Joseph E. Hernandez , Joshua A. Gullickson
Abstract: A method includes emitting light from a light source (12) onto an at least partially reflective surface (24). The reflected light (30) is collected from the surface at a screen (32) to capture the intensity distribution (34) of the reflected light with a camera (40) in a first image (42). The intensity distribution of the first image of the reflected light is processed (50) by performing suitable filtering of a Fourier transform of the intensity distribution of the reflected light so as to emphasize features having an intensity variation of interest. The features of the intensity distribution of the reflected light having the variation of interest are analyzed to determine a uniformity value for the surface.
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公开(公告)号:US20190273061A1
公开(公告)日:2019-09-05
申请号:US16461015
申请日:2017-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gillman , Shawn C. Dodds , Thomas J. Metzler , Matthew R.D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC: H01L23/00
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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