公开(公告)号：US20190273061A1

公开(公告)日：2019-09-05

申请号：US16461015

申请日：2017-11-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ankit Mahajan ,  Mikhail L. Pekurovsky ,  Matthew S. Stay ,  Daniel J. Theis ,  Ann M. Gillman ,  Shawn C. Dodds ,  Thomas J. Metzler ,  Matthew R.D. Smith ,  Roger W. Barton ,  Joseph E. Hernandez ,  Saagar A. Shah ,  Kara A. Meyers ,  James Zhu ,  Teresa M. Goeddel ,  Lyudmila A. Pekurovsky ,  Jonathan W. Kemling ,  Jeremy K. Larsen ,  Jessica Chiu ,  Kayla C. Niccum

IPC: H01L23/00

Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

公开(公告)号：US10971468B2

公开(公告)日：2021-04-06

申请号：US16461015

申请日：2017-11-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ankit Mahajan ,  Mikhail L. Pekurovsky ,  Matthew S. Stay ,  Daniel J. Theis ,  Ann M. Gilman ,  Shawn C. Dodds ,  Thomas J. Metzler ,  Matthew R. D. Smith ,  Roger W. Barton ,  Joseph E. Hernandez ,  Saagar A. Shah ,  Kara A. Meyers ,  James Zhu ,  Teresa M. Goeddel ,  Lyudmila A. Pekurovsky ,  Jonathan W. Kemling ,  Jeremy K. Larsen ,  Jessica Chiu ,  Kayla C. Niccum

IPC: H01L23/00 ,  H01L23/498 ,  B81C3/00 ,  H01L23/544

Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

公开(公告)号：US11503720B2

公开(公告)日：2022-11-15

申请号：US17270912

申请日：2019-09-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Saagar Shah ,  Mikhail L. Pekurovsky ,  Ankit Mahajan ,  Lyudmila A. Pekurovsky ,  Jessica Chiu ,  Jeremy K. Larsen ,  Kara A. Meyers ,  Teresa M. Goeddel ,  Thomas J. Metzler ,  Jonathan W. Kemling ,  Richard J. Pokorny ,  Benjamin R. Coonce ,  Chad M. Amb ,  Thomas P. Klun

IPC: H05K3/32 ,  H01L23/14 ,  H01L23/528 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

Abstract: Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

公开(公告)号：US20210212216A1

公开(公告)日：2021-07-08

申请号：US17270912

申请日：2019-09-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Saagar Shah ,  Mikhail L. Pekurovsky ,  Ankit Mahajan ,  Lyudmila A. Pekurovsky ,  Jessica Chiu ,  Jeremy K. Larsen ,  Kara A. Meyers ,  Teresa M. Goeddel ,  Thomas J. Metzler ,  Jonathan W. Kemling ,  Richard J. Pokorny ,  Benjamin R. Coonce ,  Chad M. Amb ,  Thomas P. Klun

IPC: H05K3/32 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H01L23/528 ,  H01L23/14

Abstract: Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.