公开(公告)号：US20240409784A1

公开(公告)日：2024-12-12

申请号：US18697567

申请日：2022-09-07

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Lianzhou Chen ,  Surender Maddela ,  Tobias Pick ,  Jason V. Ames

IPC: C09J7/38 ,  C09J5/00 ,  C09J11/04 ,  C09J11/08 ,  H01M10/613 ,  H01M10/6554 ,  H01M10/6567

Abstract: A cooling plate assembly comprises at least two component plates bonded together by an adhesive. The adhesive and the at least two component plates collectively define at least one fluid conduit having an inlet and an outlet. The adhesive comprises an epoxy-functional hydrolyzable organosilane compound. A method of making the cooling plate assembly, and a curable composition useful for making the adhesive are also disclosed.