公开(公告)号：US20170240771A1

公开(公告)日：2017-08-24

申请号：US15506115

申请日：2015-09-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Christopher J. Campbell ,  Brian D. Pennington ,  Han-Chi Tsai ,  Tzong-Yiing Chiang

IPC: C09J5/00 ,  C09J11/06 ,  B05D3/06 ,  C09J4/00

CPC classification number: C09J5/00 ,  B05D3/067 ,  C08F220/18 ,  C08F2220/1875 ,  C08F2220/1891 ,  C08G18/3876 ,  C08G18/6229 ,  C08G18/625 ,  C08G18/8116 ,  C08K5/06 ,  C08K5/37 ,  C09J4/00 ,  C09J11/06 ,  C09J133/066 ,  C09J133/08 ,  C09J133/14 ,  C09J143/04 ,  C09J2203/10 ,  C09J2205/31 ,  C09J2400/143 ,  C09J2433/00 ,  C08F220/20 ,  C08F222/20 ,  C08F2220/1858

Abstract: The present invention is a method of curing an adhesive composition positioned at least partially under a light-absorbing layer. The method includes providing an adhesive composition, positioning the light-absorbing layer over a surface of the adhesive composition such that there is an exposed area of the adhesive composition and a covered area of the adhesive composition and irradiating the exposed area of the adhesive composition and the covered area of the adhesive composition at the surface at a dosage of between about 100 mJ/cm2 and about 10,000 mJ/cm2. The adhesive composition includes a solute (meth)acryolyl oligomer having a molecular weight of 4 to 30 k and a Tg of less than about 20° C., a diluents monomer component and a photoinitiator.