STRUCTURAL BONDING TAPE WITH EPOXIDE MICROCAPSULES

    公开(公告)号:US20220195247A1

    公开(公告)日:2022-06-23

    申请号:US17442971

    申请日:2020-03-24

    Abstract: Curable pressure sensitive adhesive tapes comprise: a) a pressure sensitive adhesive polymer; b) particles of encapsulated first epoxy resin (microcapsules) mixed into the pressure sensitive adhesive polymer; and c) a first epoxy curative. In some embodiments, the first epoxy curative is blended into the pressure sensitive adhesive. In other embodiments, the first epoxy curative is the pressure sensitive adhesive polymer. In some embodiments, the first epoxy curative may be an adduct of a second epoxy curative and a second epoxy resin in a ratio of at least 2:1 second epoxy curative to second epoxy resin. The particles of encapsulated first epoxy resin comprise a core of first epoxy resin within a shell comprising an organic polymer, and optionally a layer of oil-in-water Pickering emulsifier particles borne on a surface of the shells. Typically, the tape may be cured to form a structural bond between adherends.

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