公开(公告)号：US11781014B2

公开(公告)日：2023-10-10

申请号：US17369258

申请日：2021-07-07

Applicant: AB7 INOVATION S.A.S.U

Inventor： René Chelle ,  David Nguyen ,  Arnaud Vilbert

IPC: C08L77/06 ,  C08K5/092 ,  C08K5/20 ,  C08K5/00 ,  A01N25/10 ,  C08K5/3432 ,  C08K5/49 ,  C08G69/34 ,  C09J177/08 ,  C08K5/02 ,  C08L77/08 ,  C08K11/00

CPC classification number: C08L77/06 ,  A01N25/10 ,  C08G69/34 ,  C08K5/0008 ,  C08K5/0058 ,  C08K5/02 ,  C08K5/092 ,  C08K5/20 ,  C08K5/3432 ,  C08K5/49 ,  C08K11/00 ,  C08L77/08 ,  C09J177/08 ,  C08K5/0008 ,  C08L77/08 ,  C08K11/00 ,  C08L77/08 ,  C09J177/08 ,  C08K11/00

Abstract: The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

公开(公告)号：US20210332241A1

公开(公告)日：2021-10-28

申请号：US17369258

申请日：2021-07-07

Applicant: AB7 INOVATION S.A.S.U

Inventor： René Chelle ,  David Nguyen ,  Arnaud Vilbert

IPC: C08L77/06 ,  C08K5/092 ,  C08K5/20 ,  C08K5/00 ,  A01N25/10 ,  C08K5/3432 ,  C08K5/49 ,  C08G69/34 ,  C09J177/08 ,  C08K5/02 ,  C08L77/08 ,  C08K11/00

Abstract: The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.