公开(公告)号：US10115522B2

公开(公告)日：2018-10-30

申请号：US15166022

申请日：2016-05-26

Applicant: ABB Schweiz AG

Inventor： Lejun Qi ,  Nan Li ,  Delun Meng ,  Sari Laihonen ,  Francois Delince

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/33 ,  H01G4/14 ,  B32B27/28 ,  B32B27/06 ,  B29C47/00 ,  B29C47/06 ,  B29C47/92 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  H01G4/18 ,  H01G13/00

Abstract: A multi-layered dielectric polymer material, a capacitor comprising the multi-layered dielectric polymer material, a use of the multi-layered dielectric polymer material and a method for forming the multi-layered dielectric polymer material are disclosed. The multi-layered dielectric polymer material may comprise a plurality of dielectric layers wherein the plurality of dielectric layers may comprise an identical base material. The base material may be compound with agents for at least one of the plurality of dielectric layers. It may overcome compatible issues for convention multi-layered material. The dielectric polymer material may have increased dielectric strength and excellent thermal properties.