公开(公告)号：US20130107455A1

公开(公告)日：2013-05-02

申请号：US13664878

申请日：2012-10-31

Applicant: ABB Technology AG

Inventor： Didier Cottet ,  Francesco Agostini ,  Thomas Grandinger ,  Andreas Vögeli

IPC: H05K7/20

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  H02M7/003 ,  H02M2007/4835 ,  H05K7/20936

Abstract: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.

Abstract translation: 提供了一种用于冷却包括电和/或电子系统的模块的电气和/或电子部件的热虹吸管冷却器装置。 模块包括导向结构和用于接收冷却空气流的入口，以及此后在模块的操作状态下释放冷却空气的出口。 引导结构用于引导通过入口进入的冷却空气，并在模块的操作状态下使模块通过出口。 模块包括具有蒸发器的热虹吸管冷却器和用于在模块的运行状态下将大部分热负荷转移到冷却空气的冷凝器。 蒸发器相对于冷凝器倾斜，其中冷凝器布置成使得大部分冷却空气流过冷凝器。