Abstract:
A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.
Abstract:
The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.
Abstract:
A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.