公开(公告)号：US20220336192A1

公开(公告)日：2022-10-20

申请号：US17857984

申请日：2022-07-05

Applicant: ABM CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK

IPC: H01J37/32 ,  C25D11/16 ,  C25D11/04 ,  C23C16/44 ,  C22C21/08 ,  C23C16/50 ,  C25D11/08

Abstract: This invention relates to a metal component, a manufacturing method thereof, and a process chamber having the metal component, and particularly to a metal component useful in a display or semiconductor manufacturing process, a manufacturing method thereof, and a process chamber having the metal component, wherein among addition elements of an aluminum alloy that constitutes the metal substrate of the metal component, the addition element existing on the surface thereof is removed, and a barrier layer having no pores is formed, thereby solving problems attributable to a conventional anodized film having a porous layer and attributable to the addition element in the form of particles on the surface of the metal substrate.

公开(公告)号：US20190144993A1

公开(公告)日：2019-05-16

申请号：US16088792

申请日：2017-03-20

Applicant: ABM CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK

IPC: C23C16/44 ,  C25D11/10 ,  C25D11/12 ,  C25D11/24

Abstract: The present invention relates to a metal part and a process chamber having the metal part and, more particularly, to a metal part and a process chamber provided with the same, the metal part enabling a process failure and a production yield decrease of a display or a semiconductor to be prevented by forming a hole-free anodization barrier layer on the surface of a metal part used in a display or semiconductor manufacturing process and a process chamber having the same.

公开(公告)号：US20180019101A1

公开(公告)日：2018-01-18

申请号：US15634125

申请日：2017-06-27

Applicant: ABM CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK

IPC: H01J37/32 ,  C23C16/50 ,  C22C21/08 ,  C25D11/08

CPC classification number: H01J37/3244 ,  C22C21/08 ,  C23C16/4404 ,  C23C16/50 ,  C25D11/024 ,  C25D11/04 ,  C25D11/08 ,  C25D11/16 ,  H01J37/32467 ,  H01J37/32477 ,  H01J2237/3321 ,  H01J2237/334

Abstract: This invention relates to a metal component, a manufacturing method thereof, and a process chamber having the metal component, and particularly to a metal component useful in a display or semiconductor manufacturing process, a manufacturing method thereof, and a process chamber having the metal component, wherein among addition elements of an aluminum alloy that constitutes the metal substrate of the metal component, the addition element existing on the surface thereof is removed, and a barrier layer having no pores is formed, thereby solving problems attributable to a conventional anodized film having a porous layer and attributable to the addition element in the form of particles on the surface of the metal substrate.