公开(公告)号：US20240327644A1

公开(公告)日：2024-10-03

申请号：US18743283

申请日：2024-06-14

Applicant: ADMATECHS CO., LTD.

Inventor： Kohei OGATA ,  Yusuke WATANABE ,  Nobutaka TOMITA

IPC: C09C1/30 ,  C08K9/06 ,  C09C3/04 ,  C09C3/12

CPC classification number: C09C1/3081 ,  C08K9/06 ,  C09C3/043 ,  C09C3/12 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/12 ,  C01P2006/82

Abstract: A filler for electronic material according to the present invention has a silica particle material produced by a dry method, wherein D50 is 0.2 μm or greater and 7.0 μm or less. Further, in the filler for electronic material according to the present invention, (BET specific surface area)/(theoretical specific surface area calculated from D50) is 0.85 or greater and 1.2 or less (requirement 1), and/or D10/D50 is 0.55 or greater and 0.75 or less (requirement 2). When at least one of the requirements 1 and 2 is satisfied, electric characteristics such as a Df value are improved. Here, the BET specific surface area is a value measured by using nitrogen, and D50 is a 50 mass % cumulative diameter, i.e., a median diameter, and means a particle diameter at 50 mass % when the masses of particles are sequentially integrated from smaller particle diameters. Similarly, D10 is a 10 mass % cumulative diameter.