公开(公告)号：US20240113004A1

公开(公告)日：2024-04-04

申请号：US17957444

申请日：2022-09-30

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： GABRIEL H. LOH ,  ERIC J. CHAPMAN ,  RAJA SWAMINATHAN

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/9211

Abstract: A semiconductor package assembly includes a package interface. An interposer die has a first surface and a second surface opposite to the first surface, where the first surface of the interposer is die positioned on the package interface. The interposer die includes a plurality of conductive connections between the first surface and second surface. A chiplet includes a connectivity region having conductive pathways, with a first portion of the connectivity region coupled to a conductive connection of the interposer die and a second portion of the connectivity region cantilevered from the interposer die.