公开(公告)号：US20210050223A1

公开(公告)日：2021-02-18

申请号：US17087388

申请日：2020-11-02

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： RAHUL AGARWAL ,  MILIND S. BHAGAVAT ,  IVOR BARBER ,  VENKATACHALAM VALLIAPPAN ,  YUEN TING CHENG ,  GUAN SIN CHOK

IPC: H01L21/322 ,  H01L29/34 ,  H01L21/268

Abstract: Various semiconductor chips with gettering regions and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a first side and a second side opposite the first side. The first side has a plurality of laser ablation craters. Each of the ablation craters has a bottom. A gettering region is in the semiconductor chip beneath the laser ablation craters. The gettering region includes plural structural defects. At least some of the structural defects emanate from at least some of the bottoms of the laser ablation craters.