公开(公告)号：US20180314670A1

公开(公告)日：2018-11-01

申请号：US16027163

申请日：2018-07-03

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： Shahin SOLKI ,  Stephen MOREIN ,  Mark S. GROSSMAN

IPC: G06F13/42 ,  G06T1/60 ,  G06T1/20 ,  G09G5/36

CPC classification number: G06F13/4282 ,  G06F3/14 ,  G06F2213/0026 ,  G06T1/20 ,  G06T1/60 ,  G09G5/006 ,  G09G5/363 ,  G09G2330/021 ,  G09G2360/06

Abstract: Embodiments of a peripheral component are described herein. Embodiments provide alternatives to the use of an external bridge integrated circuit (IC) architecture. For example, an embodiment multiplexes a peripheral bus such that multiple processors in one peripheral component can use one peripheral interface slot without requiring an external bridge IC. Embodiments are usable with known bus protocols.