公开(公告)号：US11614350B2

公开(公告)日：2023-03-28

申请号：US16575732

申请日：2019-09-19

申请人： ADVANTEST Corporation

发明人： Kazunari Suga ,  Daisuke Takano ,  Satoshi Hanamura ,  Michiro Chiba ,  Hisao Nishizaki ,  Atsushi Hayakawa

IPC分类号： G01D18/00 ,  G01R35/00 ,  G01L25/00 ,  G01R31/28 ,  G01R1/04

摘要： A sensor test apparatus having excellent versatility is provided. The sensor test apparatus includes a first application unit 40 including a first application device including a socket to which the sensor is electrically connected, and a pressure chamber 43 which applies pressure to the sensor, a test unit which tests the sensor 90 via the socket, a conveying robot which conveys the sensor into and out of the first application unit 40, and an apparatus main body which houses the first application unit 40, the test unit 35 and the conveying robot, and the apparatus main body has an opening which allows the first application unit 40 to be inserted into the apparatus main body and removed from the apparatus main body to an outside.

公开(公告)号：US11693049B2

公开(公告)日：2023-07-04

申请号：US16575658

申请日：2019-09-19

申请人： ADVANTEST Corporation

发明人： Kazunari Suga ,  Daisuke Takano ,  Satoshi Hanamura ,  Michiro Chiba ,  Hisao Nishizaki ,  Atsushi Hayakawa

IPC分类号： G01R31/28 ,  B25J9/00

CPC分类号： G01R31/2891 ,  G01R31/2829 ,  B25J9/0084

摘要： A sensor test apparatus capable of efficiently testing a sensor is provided.
A sensor test apparatus 30 which tests the pressure sensor 90 includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electronically connected, a pressure chamber 43 which applies pressure to the sensor 90, and a heat sink 443,462 which applies a thermal stress to the sensor 90, the test unit 35 which tests the sensor 90 via the socket 445, and the conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

公开(公告)号：US11460520B2

公开(公告)日：2022-10-04

申请号：US16575646

申请日：2019-09-19

申请人： ADVANTEST Corporation

发明人： Kazunari Suga ,  Daisuke Takano ,  Satoshi Hanamura ,  Michiro Chiba ,  Hisao Nishizaki ,  Atsushi Hayakawa

IPC分类号： G01R33/07 ,  G01D5/14 ,  G01R33/31 ,  G01R33/09

摘要： A sensor test system having excellent throughput is provided.
The sensor test system 1 includes a test apparatus group 20 including a plurality of sensor test apparatuses 30A to 30D coupled to each other so that the sensor 90 can be transferred, and each of the sensor test apparatuses 30A to 30D includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electrically connected, and a pressure chamber 43 which applies a pressure to the sensor 90, a test unit 35 which tests the sensor 90 via the socket 445, and a conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.