公开(公告)号：US12119142B2

公开(公告)日：2024-10-15

申请号：US17591755

申请日：2022-02-03

申请人： AGC INC.

发明人： Wataru Kasai ,  Tomoya Hosoda ,  Atsumi Mitsunaga ,  Tatsuya Terada ,  Sota Yuki

IPC分类号： H01B3/30 ,  B32B7/025 ,  B32B15/08 ,  B32B15/20 ,  B32B37/24 ,  H01B1/02 ,  H01B3/44

CPC分类号： H01B3/306 ,  B32B7/025 ,  B32B15/08 ,  B32B15/20 ,  B32B37/24 ,  H01B1/026 ,  H01B3/445 ,  B32B2037/243 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/7265 ,  B32B2457/04

摘要： A heat-resistant film that has high adhesion and low warping, a method for producing the film, and a metal-clad laminate and a coated metal conductor, using the film. The film includes an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.