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13 条记录 (耗时 0.015 秒)

    DISPERSION, AND METHODS FOR PRODUCING METAL LAMINATE AND PRINTED BOARD
    1.
    发明申请
    DISPERSION, AND METHODS FOR PRODUCING METAL LAMINATE AND PRINTED BOARD 审中-公开

    公开(公告)号：US20200317948A1

    公开(公告)日：2020-10-08

    申请号：US16904645

    申请日：2020-06-18

    申请人： AGC Inc.

    发明人： Tatsuya Terada ,  Tomoya Hosoda ,  Atsumi Yamabe

    IPC分类号： C09D127/18 ,  B05D7/14 ,  C08J3/11 ,  C09D7/65 ,  H05K3/06 ,  H05K1/03

    摘要： To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380° C. of from 1×102 to 1×106 Pa·s; the viscosity is from 50 to 10,000 mPa·s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.

    POWDER DISPERSION AND METHOD FOR PRODUCING COMPOSITE
    2.
    发明公开
    POWDER DISPERSION AND METHOD FOR PRODUCING COMPOSITE 审中-公开

    公开(公告)号：US20230227684A1

    公开(公告)日：2023-07-20

    申请号：US18115064

    申请日：2023-02-28

    申请人： AGC INC.

    发明人： Mai Nishi ,  Tatsuya Terada ,  Tomoya Hosoda ,  Wataru Kasai

    IPC分类号： C09D127/18 ,  C09D7/65 ,  C09D7/45

    CPC分类号： C09D127/18 ,  C09D7/65 ,  C09D7/45

    摘要： To provide a powder dispersion comprising a tetrafluoroethylene polymer, a particular polyoxyalkylene-modified polydimethylsiloxane and a liquid dispersion medium, and a composite having a baked product having physical properties intrinsic to the tetrafluoroethylene polymer. [Solution] The powder dispersion of the present invention comprises a powder of a tetrafluorethylene polymer, a liquid dispersion medium and a polyoxyalkylene-modified polydimethylsiloxane having a weight average molecular weight of at most 3,000 and an HLB value of from 1 to 18 calculated by Griffin's equation The composite of the present invention is produced by applying the powder dispersion of the present invention to the surface of a substrate and heating the powder dispersion.

    Process for producing wiring substrate
    3.
    发明授权
    Process for producing wiring substrate 有权

    公开(公告)号：US10271428B2

    公开(公告)日：2019-04-23

    申请号：US15926014

    申请日：2018-03-20

    申请人： AGC Inc.

    发明人： Tomoya Hosoda ,  Toru Sasaki ,  Nobutaka Kidera ,  Tatsuya Terada

    IPC分类号： H01K3/10 ,  H05K1/03 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46 ,  H05K3/00 ,  H05K3/38

    摘要： To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate, which comprises forming a hole in a laminate comprising a first conductor layer, a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant from 2.0 to 3.5, a second conductor layer, an adhesive layer and a layer (B) made of a cured product of a thermosetting resin laminated in this order, applying, to an inner wall surface of the hole, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer.

    FLUORINATED COPOLYMER COMPOSITION, METHOD FOR ITS PRODUCTION, AND MOLDED PRODUCT
    5.
    发明申请
    FLUORINATED COPOLYMER COMPOSITION, METHOD FOR ITS PRODUCTION, AND MOLDED PRODUCT 审中-公开

    公开(公告)号：US20190055390A1

    公开(公告)日：2019-02-21

    申请号：US16169247

    申请日：2018-10-24

    申请人： AGC Inc.

    发明人： Takashi Sato ,  Tomoya Hosoda ,  Tatsuya Terada ,  Masatoshi Abe

    IPC分类号： C08L27/20 ,  C08L27/18 ,  C08L27/16 ,  C08L67/02 ,  C08L81/06 ,  C08L77/00 ,  B29C45/00 ,  B29C47/36

    摘要： To provide a fluorinated copolymer composition having improved impact resistance and excellent moldability without impairing the excellent heat resistance and mechanical properties inherent to a thermoplastic heat-resistant resin. This fluorinated copolymer composition comprises a thermoplastic resin A being a melt-moldable heat-resistant thermoplastic resin and a fluorinated elastomer B being a fluorinated elastic copolymer, wherein the fluorinated elastomer B is dispersed in the thermoplastic resin A, the number average particle diameter of the fluorinated elastomer B is from 1 to 300 μm, the volume ratio of the thermoplastic resin A to the fluorinated elastomer B is from 97:3 to 55:45, and the fluorinated copolymer composition has a flexural modulus of from 1,000 to 3,700 MPa.

    Fluororesin film and laminate, and method for producing hot pressed laminate
    7.
    发明授权
    Fluororesin film and laminate, and method for producing hot pressed laminate 有权

    公开(公告)号：US11370200B2

    公开(公告)日：2022-06-28

    申请号：US16660895

    申请日：2019-10-23

    申请人： AGC Inc.

    发明人： Tomoya Hosoda ,  Tatsuya Terada ,  Atsumi Yamabe ,  Nobutaka Kidera ,  Wataru Kasai

    IPC分类号： B32B27/00 ,  C08F214/26 ,  C08J5/12 ,  C08J5/18 ,  C08J5/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/02

    摘要： The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of a second surface 10b thereof is measured by an atomic force microscope.

    Laminate, printed circuit board and method for producing laminate
    10.
    发明授权
    Laminate, printed circuit board and method for producing laminate 有权

    公开(公告)号：US10507631B2

    公开(公告)日：2019-12-17

    申请号：US16152637

    申请日：2018-10-05

    申请人： AGC Inc.

    发明人： Tatsuya Terada ,  Toru Sasaki

    IPC分类号： B32B27/08 ,  B32B7/02 ,  B32B15/04 ,  B32B15/082 ,  B32B27/30 ,  H05K1/03 ,  B32B15/08 ,  B32B37/18 ,  H05K3/46

    摘要： To provide a laminate having a fluororesin layer and a thermoplastic resin layer laminated with a good adhesive strength.A method for producing a laminate, comprising carrying out heat lamination of a fluororesin film containing the following fluororesin (A) and a thermoplastic resin film containing a thermoplastic resin (B) having a melting point higher by at least 5° C. than the melting point of the fluororesin (A), at a temperature of at least a melting point of the fluororesin (A) and lower than a melting point of the thermoplastic resin (B). The fluororesin (A) is a fluororesin having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melt flow rate of from 0.5 to 30 g/10 min at 372° C. under a load of 49N.