公开(公告)号：US20140145325A1

公开(公告)日：2014-05-29

申请号：US13688820

申请日：2012-11-29

申请人： ALAN J. MAGNUS ,  FRANCISCO CHAIDEZ

发明人： ALAN J. MAGNUS ,  FRANCISCO CHAIDEZ

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/96 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48482 ,  H01L2224/49175 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An embodiment of an electronic device includes an IC die with a top surface and a bond pad exposed at the top surface. A stud bump (or stack of stud bumps) is connected to the bond pad, and the stud bump and die are encapsulated with encapsulant. A trench is formed from a top surface of the encapsulant to the stud bump, resulting in the formation of a trench-oriented surface of the stud bump, which is exposed at the bottom of the trench. An end of an interconnect is connected to the trench-oriented surface of the stud bump. The interconnect extends above the encapsulant top surface, and may be coupled to another IC die of the same electronic device, another IC die that is distinct from the device, or another conductive feature of the device or a larger electronic system in which the device is incorporated.

摘要翻译： 电子设备的一个实施例包括具有顶表面的IC芯片和在顶表面处暴露的接合焊盘。 螺栓凸块（或螺柱凸起的堆叠）连接到接合焊盘，并且螺柱凸块和管芯用密封剂封装。 沟槽由密封剂的顶表面形成到凸起凸起部，从而形成凸起凸起的沟槽取向表面，其暴露在沟槽的底部。 互连的一端连接到螺柱凸起的沟槽取向表面。 互连延伸在密封剂顶表面上方，并且可以耦合到同一电子器件的另一个IC管芯，与该器件不同的另一个IC管芯，或该器件的另一个导电特征或该器件的较大电子系统 并入。