Method of copper electroplating printed circuit boards
    1.
    发明授权
    Method of copper electroplating printed circuit boards 失效
    铜电镀印刷电路板的方法

    公开(公告)号:US3562117A

    公开(公告)日:1971-02-09

    申请号:US3562117D

    申请日:1967-09-18

    Applicant: ALLIED CHEM

    CPC classification number: H05K3/423 C25D3/38

    Abstract: A COPPER PLATING BATH COMPOSITION COMPRISING A MIXTURE OF A COPPER SALT AND FLUOBORIC ACID, EACH BEING PRESENT IN AN AMOUNT, WHICH UPON DISSOLUTION IN AN AQUEOUS BATH PROVIDES A COPPER CONCENTRATION FROM 5 TO 35 GRAMS PER LITER AND FROM 100 TO 700 GRAMS PER LITER OF FLUOBORIC ACID. THE PLATING BATHS OF THE PRESENT INVENTION HAVE PARTICULAR EFFICACY IN THE COPPER PLATING OF RECESSED AREAS, SUCH AS PERFORATED SUBSTRATES FOR USE AS PRINTED CIRCUIT, BOARDS.

    Zinc electroplating process and acidic zinc fluoborate electrolyte therefor
    2.
    发明授权
    Zinc electroplating process and acidic zinc fluoborate electrolyte therefor 失效
    ZINC电镀工艺及其酸性锌电解液

    公开(公告)号:US3655533A

    公开(公告)日:1972-04-11

    申请号:US3655533D

    申请日:1970-11-12

    Applicant: ALLIED CHEM

    CPC classification number: C25D3/22

    Abstract: An acidic zinc electroplating bath comprising zinc fluoborate dissolved in an aqueous liquid containing as an iron- and metal oxide-deposition inhibitor a small effective amount of a mixture of a 4-hydroxy-, 4-alkyl- or aryl-, 5-acyl- or aroyl-piperidine and thiourea or N-substituted derivative thereof. The invention also includes an improved process for zinc-electroplating ferrous metals from such bath.

    Abstract translation: 一种酸性锌电镀浴,其包含溶解在含有铁和金属氧化物沉积抑制剂的含水液体中的氟硼酸锌,有效量的4-羟基-4-烷基 - 或芳基-5-酰基 - 或芳酰基 - 哌啶和硫脲或其N-取代的衍生物。 本发明还包括从这种浴中锌电镀黑色金属的改进方法。

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