公开(公告)号：US20160284621A1

公开(公告)日：2016-09-29

申请号：US15068761

申请日：2016-03-14

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Hideki GOCHO ,  Shuji YANAGI ,  Masaya YAMATANI ,  Hisayuki YAZAWA

IPC: H01L23/31 ,  B81C1/00 ,  B81B7/00 ,  H01L23/00 ,  H01L21/56

CPC classification number: B81B7/0041 ,  B81B7/0061 ,  B81B2201/0214 ,  B81B2201/0264 ,  B81C1/00269 ,  B81C1/00293 ,  B81C1/00309 ,  B81C2203/019 ,  H01L21/563 ,  H01L24/17 ,  H01L2224/1713

Abstract: An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main surface and the chip so as to be placed inside of the edges of the chip in a plan view of the main surface, a dam provided between the main surface and the chip so as to extend at least from the edges of the chip to outer positions of the bump electrodes in a plan view of the main surface, and an under-fill material provided at least in a clearance between the dam and the chip. Between the main surface and the sensor, a space is formed in a region enclosed by the bump electrodes in a plan view of the main surface. The under-fill material is disposed outside of the space in a plan view of the main surface.

Abstract translation: 电子部件具有主表面的电路板，具有面向主表面的传感器的芯片，设置在主表面和芯片之间的凸起电极，以便在平面图中放置在芯片的边缘内部 主表面，设置在主表面和芯片之间的坝，以便在主表面的平面图中至少从芯片的边缘延伸到凸块电极的外部位置，并且至少提供了填充材料 在大坝和芯片之间的间隙。 在主表面和传感器之间，在主表面的平面图中由凸起电极包围的区域中形成空间。 底部填充材料在主表面的平面图中设置在空间的外部。