公开(公告)号：US20160284621A1

公开(公告)日：2016-09-29

申请号：US15068761

申请日：2016-03-14

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Hideki GOCHO ,  Shuji YANAGI ,  Masaya YAMATANI ,  Hisayuki YAZAWA

IPC: H01L23/31 ,  B81C1/00 ,  B81B7/00 ,  H01L23/00 ,  H01L21/56

CPC classification number: B81B7/0041 ,  B81B7/0061 ,  B81B2201/0214 ,  B81B2201/0264 ,  B81C1/00269 ,  B81C1/00293 ,  B81C1/00309 ,  B81C2203/019 ,  H01L21/563 ,  H01L24/17 ,  H01L2224/1713

Abstract: An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main surface and the chip so as to be placed inside of the edges of the chip in a plan view of the main surface, a dam provided between the main surface and the chip so as to extend at least from the edges of the chip to outer positions of the bump electrodes in a plan view of the main surface, and an under-fill material provided at least in a clearance between the dam and the chip. Between the main surface and the sensor, a space is formed in a region enclosed by the bump electrodes in a plan view of the main surface. The under-fill material is disposed outside of the space in a plan view of the main surface.

Abstract translation: 电子部件具有主表面的电路板，具有面向主表面的传感器的芯片，设置在主表面和芯片之间的凸起电极，以便在平面图中放置在芯片的边缘内部 主表面，设置在主表面和芯片之间的坝，以便在主表面的平面图中至少从芯片的边缘延伸到凸块电极的外部位置，并且至少提供了填充材料 在大坝和芯片之间的间隙。 在主表面和传感器之间，在主表面的平面图中由凸起电极包围的区域中形成空间。 底部填充材料在主表面的平面图中设置在空间的外部。

公开(公告)号：US20130126987A1

公开(公告)日：2013-05-23

申请号：US13744951

申请日：2013-01-18

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Yoshitaka UTO ,  Akira MIYATAKE ,  Toru TAKAHASHI ,  Toshihiro KOBAYASHI ,  Chiaki KERA ,  Hisayuki YAZAWA ,  Hisanobu OKAWA

IPC: H01L23/10 ,  H01L21/56

CPC classification number: H01L23/10 ,  B81B2207/07 ,  B81C1/00269 ,  B81C2203/019 ,  B81C2203/035 ,  G01C19/5733 ,  G01P15/0802 ,  G01P15/125 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A first sealing layer having a frame-like shape and a first contact layer are formed on a back surface of a frame portion of a sensor substrate. The first contact layer is separated from the first sealing layer, extends through a functional member and an insulation layer, and is electrically connected to the functional member and a first base member. A second sealing layer and a second contact layer are formed on a surface of a wiring substrate. The second sealing layer faces the first sealing layer. The second contact layer is separated from the second sealing layer, extends through the insulation layer, and is electrically connected to the second base member. The sealing layers are eutectically bonded to each other. The contact layers are electrically connected to each other, and thereby the first and second base members and the frame portion have the same potential.

Abstract translation: 在传感器基板的框架部分的后表面上形成具有框状形状的第一密封层和第一接触层。 第一接触层与第一密封层分离，延伸通过功能部件和绝缘层，并且电连接到功能部件和第一基体部件。 在布线基板的表面上形成第二密封层和第二接触层。 第二密封层面向第一密封层。 第二接触层与第二密封层分离，延伸穿过绝缘层，并与第二基底部件电连接。 密封层彼此共晶结合。 接触层彼此电连接，从而第一和第二基底构件和框架部分具有相同的电位。

公开(公告)号：US20150008544A1

公开(公告)日：2015-01-08

申请号：US14321947

申请日：2014-07-02

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Hisayuki YAZAWA ,  Katsuya KIKUIRI ,  Toru TAKAHASHI

IPC: B81B7/00 ,  G01L9/00

CPC classification number: G01L9/0054 ,  B81B3/0086 ,  B81B2201/0264

Abstract: A physical quantity sensor detects a physical quantity using a piezoresistive effect and includes a first-conductivity-type well layer disposed on a first insulating layer, a plurality of second-conductivity-type piezoresistive layers disposed on a surface side of the first-conductivity-type well layer, and a second-conductivity-type isolation layer disposed between the plurality of second-conductivity-type piezoresistive layers so as to pass through the first-conductivity-type well layer from a surface of the first-conductivity-type well layer to a surface of the first insulating layer.

Abstract translation: 物理量传感器使用压阻效应来检测物理量，并且包括设置在第一绝缘层上的第一导电型阱层，设置在第一导电型阱层的表面侧的多个第二导电型压阻层， 以及设置在所述多个第二导电型压阻层之间的第二导电型隔离层，以从所述第一导电型阱层的表面通过所述第一导电型阱层 到第一绝缘层的表面。

公开(公告)号：US20150355124A1

公开(公告)日：2015-12-10

申请号：US14663283

申请日：2015-03-19

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Hisayuki YAZAWA ,  Shuji YANAGI ,  Atsushi TONDOKORO ,  Hisanobu OKAWA

IPC: G01N27/22

CPC classification number: G01N27/223

Abstract: A humidity sensing portion is mounted in a gap between a first opposite member and a second opposite member.Metal joints and dummy joints are provided in the gap between the first opposite member and the second opposite member, and the two opposite members are fixed to each other through the metal joints and the dummy joints. Since only the metal joints and the dummy joints are present in the gap between the two opposite members, gas to be measured is easily introduced into the humidity sensing portion, and the sensing response to the humidity change is improved.

Abstract translation: 湿度检测部分安装在第一相对构件和第二相对构件之间的间隙中。 在第一相对构件和第二相对构件之间的间隙中设置有金属接头和虚拟接头，并且两个相对构件通过金属接头和虚拟接头彼此固定。 由于在两个相对构件之间的间隙中仅存在金属接头和虚拟接头，因此容易将待测量的气体引入湿度检测部，并且改善对湿度变化的感测响应。