-
公开(公告)号：US20150221413A1
公开(公告)日：2015-08-06
申请号：US14685964
申请日：2015-04-14
发明人： Yui ABE , Yoshihiro TAGUCHI , Mitsuo BITO , Yoshiyuki ASABE , Yasuyuki KITAMURA , Tomoyuki YAMAI , Koji OGUMA , Tomofumi OBA
IPC分类号： H01B5/14 , C23C14/34 , H01L31/0224
CPC分类号： H01B5/14 , B82Y30/00 , B82Y40/00 , C23C14/34 , H01B1/02 , H01L31/0224 , H01L31/022466 , H01L31/1884 , H01L51/0021 , H01L51/102 , H01L51/442 , H01L51/5206 , H05K1/09 , H05K3/388 , H05K2201/0108 , H05K2201/0326 , H05K2201/0338 , H05K2201/10128 , Y02E10/50 , Y10T428/31663 , Y10T428/31678
摘要： A conductor includes: a transparent conductive film which is formed on a transparent substrate and includes a silver nanowire; and a metal film of which at least a portion is formed to overlap the transparent conductive film, in which a portion in which the transparent conductive film and the metal film overlap each other includes a buffer film which has adhesion to each of the transparent conductive film and the metal film and does not impede conduction between the transparent conductive film and the metal film. Preferably, the buffer film is, for example, an ITO film, and at this time, an upper surface of the transparent conductive film is a reverse-sputtered surface.
摘要翻译： 导体包括：透明导电膜，其形成在透明基板上并且包括银纳米线; 和形成有透明导电膜和金属膜彼此重叠的部分的透明导电膜重叠的至少一部分的金属膜包括具有与透明导电膜各自粘合的缓冲膜 和金属膜，并且不妨碍透明导电膜和金属膜之间的导通。 优选地，缓冲膜是例如ITO膜，此时，透明导电膜的上表面是反溅射表面。
-
公开(公告)号：US20180047478A1
公开(公告)日：2018-02-15
申请号：US15792452
申请日：2017-10-24
发明人： Yui ABE , Yoshihiro TAGUCHI , Mitsuo BITO , Yoshiyuki ASABE , Yasuyuki KITAMURA , Tomoyuki YAMAI , Koji OGUMA , Tomofumi OBA
IPC分类号： H01B5/14 , B82Y30/00 , H05K1/09 , C23C14/34 , H01L51/00 , H01L31/18 , H01B1/02 , H05K3/38 , H01L31/0224 , H01L51/52 , B82Y40/00 , H01L51/10 , H01L51/44
CPC分类号： H01B5/14 , B82Y30/00 , B82Y40/00 , C23C14/34 , H01B1/02 , H01L31/0224 , H01L31/022466 , H01L31/1884 , H01L51/0021 , H01L51/102 , H01L51/442 , H01L51/5206 , H05K1/09 , H05K3/388 , H05K2201/0108 , H05K2201/0326 , H05K2201/0338 , H05K2201/10128 , Y02E10/50 , Y10T428/31663 , Y10T428/31678
摘要： A conductor includes (i) a substrate, (ii) a transparent conductive film formed on the substrate and including a silver nanowire, (iii) a metal film formed over the transparent conductive film such that at least a portion thereof overlaps the transparent conductive film, and (iv) a buffer film provided between the transparent conductive film and the metal film, the buffer film having adhesion to each of the transparent conductive film and the metal film, and not impeding conductivity between the transparent conductive film and the metal film. Preferably, the buffer film is formed of an organic material having respective functional groups capable of bonding to the transparent conductive film and the metal film.
-
搜索结果
2 条记录 (耗时 0.014 秒)
